Integrated Antenna Package With Shielding Pillars for Low-Loss mmWave
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Solution Overview
Problem
Existing semiconductor packages face challenges in providing high efficiency and wide bandwidth while maintaining reliability and low cost, particularly in integrating mmWave antennas for applications like 5G communication and automotive radar.
Innovation Solution
A substrate-less semiconductor package with integrated antenna and shielding pillars, utilizing a dual-mold structure that includes a base film with interconnect elements, metal studs, and shielding pillars, along with re-distribution structures and through-mold-vias to enhance antenna performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a typical FCBGA AiP structure with RF chip attached to package substrate is used, then reliable connection to main PCB is achieved, but interconnect loss increases and antenna efficiency decreases
Solution Approach 1:
The patent extracts and eliminates the package substrate from the traditional FCBGA AiP structure, directly attaching the RF chip to the PCB via solder balls. This removal of the intermediate substrate layer reduces the number of interconnect interfaces and associated losses, while maintaining reliable electrical connection.
Solution Approach 2:
The patent merges the RF chip mounting function directly onto the PCB board, eliminating the separate package substrate layer. The RF chip is flip-chip attached directly to PCB traces, combining the antenna feed network and RF chip interconnection into a more integrated structure that reduces signal path length and losses.
2Loss of energy
If mmWave antennas are integrated in the package, then high gain and high radiation efficiency are achieved, but dielectric loss increases due to package materials
Solution Approach 1:
The patent removes the package substrate that causes dielectric losses and replaces it with air or low-loss molding compound environment. The RF chip is mounted directly on PCB without an intermediate high-loss substrate, significantly reducing dielectric losses at mmWave frequencies while maintaining structural support and electrical connection.
3Object-affected harmful factors
If shielding pillars are added to improve antenna radiation efficiency, then harmful interference is reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the shielding pillar structure with the existing PCB ground plane and package molding compound. The shielding pillars are integrated into the package structure during the molding process, utilizing existing manufacturing steps rather than adding separate complex assembly operations, thereby reducing manufacturing difficulty while providing effective shielding.
Data Source
AI summary
A semiconductor package includes a base film, a semiconductor die on the base film, metal studs on the semiconductor die, shielding pillars on the base film and around the semiconductor die, a first molding compound encapsulating the semiconductor die, the metal studs, and the shielding pillars, a first re-distribution structure on the first molding compound, a second molding compound on the first re-distribution structure, through-mold-vias in the second molding compound, and a second re-distribution structure on the second molding compound and electrically connected to the through-mold-vias. The second re-distribution structure comprises an antenna.