Antenna Packaging Structure for Horizontal and Vertical Radiation
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Solution Overview
Problem
Traditional fan-out wafer-level packaging structures are limited to vertical antenna radiation, making it difficult to further miniaturize devices due to the constraints of molding thickness and design complexity.
Innovation Solution
A method and structure that integrate antennas to radiate electromagnetic waves in both horizontal and vertical directions by using a support substrate, a rewiring layer with dielectric and metal wire layers, an antenna array layer with first and second antennas, and a molding material layer, allowing for simultaneous side and front radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional fan-out package structures with vertical radiation antennas are used, then the device structure is simple and easy to manufacture, but the device area cannot be further reduced due to molding thickness limits
Solution Approach 1:
The patent introduces horizontal radiation capability in addition to vertical radiation, transforming the antenna system from single-direction to multi-directional radiation. This dimensional expansion allows the antenna to radiate electromagnetic waves both vertically and horizontally, effectively utilizing three-dimensional space for radiation and reducing the device's footprint area.
Solution Approach 2:
The antenna system is divided into two independent antenna arrays: a vertical radiation antenna array and a horizontal radiation antenna array. Each array can be independently designed and optimized, with the vertical array handling vertical radiation and the horizontal array handling horizontal radiation, thereby simplifying the overall design complexity while achieving multi-directional coverage.
2Adaptability or versatility
If only vertical radiation antennas are designed, then the manufacturing process is straightforward, but the radiation coverage is limited and device performance is compromised
Solution Approach 1:
The patent merges two antenna arrays with different radiation characteristics into a single integrated packaging structure. The vertical radiation antenna array and horizontal radiation antenna array are combined within the same molding, creating a unified antenna system that provides both vertical and horizontal radiation coverage, thereby enhancing adaptability and versatility.
Solution Approach 2:
The antenna packaging structure is designed to perform multiple radiation functions simultaneously. The same packaging structure supports both vertical radiation (for traditional communication scenarios) and horizontal radiation (for extended coverage scenarios), making the device adaptable to various application requirements without needing separate antenna systems.
3Reliability
If the molding material layer thickness is increased to accommodate antenna design, then vertical radiation antennas can be implemented, but the device size increases and miniaturization is hindered
Solution Approach 1:
By introducing horizontal radiation capability, the patent reduces the dependency on molding thickness for achieving adequate radiation performance. The horizontal radiation antenna array can radiate electromagnetic waves in the horizontal direction without requiring the same thickness constraints as vertical radiation antennas, thereby enabling device miniaturization while maintaining reliable radiation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances antenna design flexibility, improves device performance, and reduces the thickness of the molding material layer, facilitating further device miniaturization while maintaining performance.
Implementation Method 1
the plurality of first antennas radiates in the horizontal direction, and the plurality of second antennas radiates in the vertical direction
Data Source
AI summary
The present disclosure provides an antenna packaging structure radiating e-m waves in a horizontal direction and a vertical direction and a method making the same. The method includes: providing a support substrate, forming a separation layer on a surface of the support substrate; forming a rewiring layer on the separation layer; forming an antenna array layer on the rewiring layer, the antenna array layer is electrically connected to the metal wire layer; the antenna array layer includes first antennas and second antennas arranged in an array respectively, radiating e-m waves in the horizontal direction and the vertical direction respectively; forming a molding material layer; removing the support substrate and the separation layer; forming solder ball bumps on a surface of the rewiring layer away from the antenna array layer, the solder ball bumps are electrically connected to the metal wire layer; disposing a chip on the solder ball bumps.