Integrated Antenna Array Packaging With 3D Routing and Heat Spreading
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Solution Overview
Problem
Current packaging solutions for integrated antenna arrays face challenges in scaling up with increasing frequencies, leading to space constraints, complex routing, and inefficient heat dissipation, while also failing to integrate high-Q filter solutions and maintain beam steering accuracy.
Innovation Solution
An integrated antenna unit assembly using a carrier structure with high thermal conductivity, incorporating antenna elements, ICs, and filter elements, where the carrier structure acts as a heat spreader, and integrates filter elements within the package, reducing routing complexity and enabling efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of antenna elements is increased to achieve higher data capacity, then the data capacity increases, but the physical space required and routing complexity increase
Solution Approach 1:
The patent transitions from planar 2D antenna array arrangements to three-dimensional configurations where antenna elements are positioned at different heights and angles relative to the carrier board. This vertical dimensionality allows more elements to be packed into a smaller footprint while maintaining proper spacing, thereby increasing data capacity without proportionally increasing routing complexity
Solution Approach 2:
The patent implements a hierarchical packaging structure where multiple antenna elements are integrated into a compact carrier structure, which itself is packaged as a module. This nested arrangement allows numerous antenna elements to be contained within a limited space, achieving high data capacity while managing routing complexity through modular integration
2Speed
If the frequency is increased to achieve higher data rates, then the data rate increases, but the element-to-element distance must be reduced which causes integration space problems
Solution Approach 1:
By utilizing the third dimension (vertical height) in addition to the horizontal plane, the patent enables antenna elements to be positioned in a 3D space around the carrier board. This allows maintaining adequate element spacing for high frequency operation while fitting more elements into a compact overall package, thus achieving high data rates without excessive integration space requirements
Solution Approach 2:
The patent employs a carrier structure made of material with high thermal conductivity that also provides mechanical support for positioning antenna elements at precise three-dimensional locations. This composite approach allows the same structure to serve both thermal management and spatial positioning functions, enabling high-frequency operation with reduced element spacing while managing heat dissipation
3Volume of moving object
If the element-to-element distance is reduced to achieve smaller array size, then the array size decreases, but the routing becomes more difficult and losses increase
Solution Approach 1:
The patent introduces a carrier structure as an intermediary component that provides integrated signal routing paths between antenna elements. This carrier acts as a mediator that manages signal distribution in a compact manner, reducing the difficulty of routing and minimizing signal losses by providing optimized transmission paths within the compact array structure
Solution Approach 2:
The patent combines multiple functions into the carrier structure: it serves as the mechanical support for antenna elements, the thermal management system, and the signal routing infrastructure. By merging these functions into a single integrated component, the patent achieves compact array size while managing signal losses through integrated routing optimization
4Temperature
If the carrier structure is made of thermally conductive material to improve heat dissipation, then the heat management improves, but the cost increases
Solution Approach 1:
The patent designs the carrier structure to perform multiple functions simultaneously: it provides mechanical support for antenna elements, serves as the thermal management system through its high thermal conductivity, and acts as the signal routing infrastructure. By making the carrier structure multi-functional, the patent achieves effective heat dissipation without requiring separate cooling components, thereby controlling manufacturing costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for compact, high-density antenna arrays with reduced signal interference and improved heat management, facilitating efficient operation at high frequencies and integrating filter elements, thus addressing space and routing challenges.
Implementation Method 1
The carrier structure of the integrated antenna unit assembly is made of a material with high thermal conductivity
Data Source
Figure 1A~1B
Figure 1C~2
Figure 3A~3D
AI summary
The present invention relates to an integrated antenna unit assembly and antenna arrays and antenna packages comprising the antenna unit assembly. The antenna unit assembly comprises a carrier structure, one or more antenna element(s) arranged on a surface of a first edge part of the carrier structure. The integrated antenna unit assembly further comprises an integrated circuit (IC) arrangement comprising one or more circuits mounted on a first surface of a first side of the carrier structure. Further, a first dielectric element mounted on a second surface of the first side of the carrier structure and coupling means arranged to electrically couple the IC to the first dielectric element are also comprised in the integrated antenna unit assembly. The carrier structure of the integrated antenna unit assembly comprises a second edge part, opposite to the first edge part, which is adapted to be surface mounted on a surface of a second dielectric element.