Antenna Structure Integrated in Packaging Substrate

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Solution Overview

Problem

The existing fabrication process of semiconductor communication modules is complex and costly due to the need for bonding elements between the antenna substrate and packaging substrate, which hinders miniaturization and antenna efficiency, and results in inaccurate thickness control.

Innovation Solution

The antenna structure is directly formed within the packaging substrate, eliminating the need for bonding elements and using a thin insulating and antenna layer to reduce thickness and improve efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If bonding elements are used to connect antenna substrate and packaging substrate, then electrical connection is achieved, but fabrication process complexity increases and cost increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidfabrication process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The antenna structure is merged directly into the packaging substrate by forming the antenna pattern on the same substrate that houses the circuit structure. This integration eliminates the need for separate antenna substrates and bonding elements, thereby simplifying the fabrication process while maintaining electrical connection functionality.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If bonding elements are used to connect antenna substrate and packaging substrate, then electrical connection is achieved, but fabrication cost increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidfabrication cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If antenna substrate with great thickness is used, then antenna function is achieved, but miniaturization is hindered and antenna efficiency is adversely affected

Engineering Contradiction:

Improveantenna functionVSAvoidpackage thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The antenna structure is merged directly into the packaging substrate, allowing the use of thin substrate material. The antenna pattern is formed on the same thin substrate that houses the circuit structure, thereby achieving miniaturization while maintaining antenna functionality and improving efficiency through reduced thickness.

Inventive Principle:

Principle #5Merging (Combining)

4Reliability

If multiple components including antenna substrate, adhesive tape and solder balls are used, then electrical connection and antenna function are achieved, but tolerance accumulation occurs and thickness control becomes inaccurate

Engineering Contradiction:

Improveelectrical connectionVSAvoidthickness control accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The antenna structure is merged directly into the packaging substrate, eliminating multiple separate components. This integration reduces the number of interfaces and bonding steps, thereby minimizing tolerance accumulation and enabling accurate thickness control of the final package.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS10431535B2Electronic package and method for fabricating the same

Publication Date: 2019.10.01 SILICONWARE PRECISION IND CO LTD

AI summary

An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, and disposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.