Transparent Antenna Pad Layout for RF Signal Isolation

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Solution Overview

Problem

Signal interference occurs in antenna devices due to close proximity of signal lines, affecting performance efficacy.

Innovation Solution

The antenna device incorporates a transparent substrate with multiple antenna units, each comprising an antenna electrode, ground electrode, thin-film circuit structure, and redistribution structure, with separate bonding areas for high-frequency and low-frequency chip pads to mitigate interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If signal lines are placed in close proximity to one another, then the antenna device can achieve higher integration and smaller size, but signal interference increases and performance deteriorates

Engineering Contradiction:

Improveantenna device sizeVSAvoidsignal interference

Core Design Contradiction:

Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The bonding area is divided into a first bonding area for digital and analog signal pads, and a second bonding area for RF and antenna signal pads. This spatial segmentation separates different signal types to reduce interference while maintaining compact device size.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the bonding area are assigned different functions: the first bonding area handles low-frequency digital and analog signals, while the second bonding area handles high-frequency RF and antenna signals. This local differentiation optimizes signal integrity for each type while maintaining overall integration.

Inventive Principle:

Principle #3Local quality

2Device complexity

If multiple signal types are integrated in a single bonding area, then device complexity is reduced, but signal interference between different signal types increases

Engineering Contradiction:

Improvebonding area configurationVSAvoidsignal transmission quality

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The bonding area is segmented into two distinct regions: a first bonding area containing digital and analog signal pads, and a second bonding area containing RF and antenna signal pads. This segmentation reduces cross-signal interference while maintaining a relatively simple overall device structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent uses spatial dimensionality to separate different signal types by creating distinct bonding areas in different locations on the substrate, allowing multiple signal types to coexist without interference while maintaining device integration.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12614843B2Antenna device

Publication Date: 2026.04.28 AU OPTRONICS CORP

AI summary

An antenna device includes a transparent substrate and a plurality of antenna units arranged on the transparent substrate. Each antenna unit includes an antenna electrode, a ground electrode, a thin-film circuit structure, a redistribution structure and a chip. The redistribution structure includes a digital signal pad, an analog signal pad, a radio frequency (RF) signal pad, and an antenna signal pad. The chip is bonded to the digital signal pad, the analog signal pad, the RF signal pad, and the antenna signal pad. The digital signal pad and the analog signal pad are disposed in a first bonding area. The RF signal pad and the antenna signal pad are disposed in a second bonding area.