Antenna Pattern Deformation Prevention in Wafer-Level Packaging

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Solution Overview

Problem

Current wafer-level packaging technologies face challenges in forming antenna patterns without deformation, especially for large or complex designs, due to limitations in stencil design and material properties, which affects the integrity and performance of semiconductor devices.

Innovation Solution

The method involves forming antenna patterns with trenches on a stencil using bridge structures to prevent deformation, where the antenna patterns are created with recessed portions that correspond to the positions of trenches, ensuring the patterns remain intact and functional.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If antenna patterns are formed on a stencil using conventional methods, then the manufacturing process is simple, but the antenna patterns deform especially for large or complex designs

Engineering Contradiction:

Improveantenna pattern integrityVSAvoidstencil structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The stencil is divided into multiple segments with bridge structures connecting them. These bridge structures act as support elements that prevent deformation of large or complex antenna patterns while allowing the stencil to maintain its structural integrity during the formation process

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The bridge structures are pre-formed as part of the stencil design before the antenna pattern formation process begins. This preliminary structural preparation ensures that the stencil can support complex antenna designs without deforming during material deposition

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If trenches are added to the antenna patterns to prevent deformation, then the antenna pattern integrity is maintained, but the manufacturing process becomes more complex

Engineering Contradiction:

Improveantenna pattern deformation preventionVSAvoidfabrication process simplicity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The solution moves from a two-dimensional flat antenna pattern to a three-dimensional structure with trenches. These trenches create recessed portions that provide structural support and prevent deformation, adding a vertical dimension to the design that enhances stability

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If bridge structures are used in the stencil, then large and complex antenna designs can be supported, but the stencil design becomes more complicated

Engineering Contradiction:

Improveantenna design flexibilityVSAvoidstencil structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The bridge structures serve multiple functions: they provide structural support to prevent deformation, enable the stencil to accommodate various antenna designs, and maintain structural integrity during manufacturing. This multi-functionality increases adaptability while managing complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS11374303B2Package structure and method of fabricating the same

Publication Date: 2022.06.28 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure includes a semiconductor die, an insulating encapsulant, a redistribution layer and a plurality of antenna patterns. The semiconductor die has an active surface and a backside surface opposite to the active surface. The insulating encapsulant is encapsulating the semiconductor die. The redistribution layer is located on the active surface of the semiconductor die and over the insulating encapsulant. The plurality of antenna patterns is located over the semiconductor die, wherein the plurality of antenna patterns comprises a plurality of trenches located on a surface of the plurality of antenna patterns.