Antenna Module PCB Feed Structure for Lower Signal Loss
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Solution Overview
Problem
Existing antenna structures in wireless communication systems face challenges in reducing signal transmission loss and improving performance, particularly in 5G communication systems, due to increasing numbers of antennas and complex assembly processes that affect reliability and manufacturing costs.
Innovation Solution
An antenna module with a grid array connection between an antenna board and a main board, featuring a feeding line on the antenna board or an air layer, which reduces feeding loss by direct interconnection and uses an air-based feed structure to minimize dielectric loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a feeding line is formed on a PCB layer, then signal transmission is enabled, but feeding loss increases due to dielectric material interference
Solution Approach 1:
The patent extracts the feeding line from the dielectric PCB layer and relocates it to an air layer environment. By removing the feeding line from the lossy dielectric medium, the patent eliminates dielectric loss while maintaining signal transmission functionality through the air-based feed structure.
Solution Approach 2:
The patent introduces an air layer as an intermediary medium between the antenna board and main board. This air layer serves as a low-loss transmission medium that replaces the traditional dielectric PCB layer, reducing feeding loss while still enabling electrical connection through the grid array structure.
2Productivity
If multiple antennas are increased to improve communication performance, then data rate increases, but signal transmission loss increases
Solution Approach 1:
The patent converts the harmful effect of dielectric loss into a benefit by replacing the dielectric medium with an air layer. The air layer, which has minimal dielectric loss, becomes the advantageous transmission medium that enables multiple antennas to operate with reduced signal loss, thereby improving overall communication performance.
3Reliability
If a grid array is used to couple antenna board and main board, then connection reliability improves, but manufacturing complexity increases
Solution Approach 1:
The patent segments the antenna system into separate antenna board and main board components, coupled through a grid array. This segmentation allows for independent manufacturing and testing of each board, improving reliability while enabling modular assembly that can be standardized to reduce manufacturing complexity.
Data Source
AI summary
An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.