Multi-Surface Antenna Assembly for Automated PCB Mounting

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Solution Overview

Problem

Existing antennas are unsuitable for automated assembly on production lines and lack flexibility in mounting modes, particularly for dual horizontal and vertical orientations.

Innovation Solution

An antenna device with a substrate having antenna patterns on multiple surfaces and extendable pads for welding onto a printed circuit motherboard, allowing both horizontal and vertical mounting modes, and a bracket for automated assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Extent of automation

If antennas are manually assembled using traditional mounting methods, then assembly flexibility is maintained, but automation capability is lost

Engineering Contradiction:
Improveautomation capabilityVSAvoidmounting mode flexibility
Core Design Contradiction:
Extent of automationVSAdaptability or versatility

Solution Approach 1:

The antenna device is designed with a standardized substrate structure that can be mounted in multiple orientations (horizontal and vertical) and on different surfaces (first main surface, second main surface, or side surface), allowing a single component design to serve multiple mounting configurations and enable automated assembly across various application scenarios

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If antennas are designed for single-mode mounting, then structural simplicity is maintained, but adaptability to different mounting orientations is reduced

Engineering Contradiction:
Improvedual mounting mode capabilityVSAvoidstructural complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The antenna substrate is designed to utilize multiple spatial dimensions and surfaces (first main surface, second main surface, and side surface) for mounting, allowing the antenna to be installed in different orientations without increasing the complexity of the antenna's core functional structure

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Productivity

If traditional manual assembly methods are used, then handling simplicity is maintained, but production efficiency is reduced

Engineering Contradiction:
Improveproduction efficiencyVSAvoidassembly process complexity
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The invention replaces manual mechanical assembly operations with automated welding technology, where the antenna pad is welded directly to the printed circuit motherboard, eliminating the need for manual handling and significantly improving production efficiency while maintaining ease of manufacture through standardized automated processes

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables flexible, automated assembly on production lines, optimizing performance and reducing costs while allowing for reduced motherboard layout and improved manufacturing automation.

Implementation Method 1

The antenna device is welded onto a printed circuit motherboard at the antenna pad

Methodology Applied
Scientific EffectWelding: Welding

Data Source

PatentUS20250273864A1Antenna Device and Antenna Device Assembly
Publication Date: 2025.08.28 TYCO ELECTRONICS HOLDINGS (BERMUDA) NO 7 LTD
  • US20250273864A1 patent drawing
  • US20250273864A1 patent drawing
  • US20250273864A1 patent drawing

AI summary

An antenna device includes a substrate having a first main surface, a second main surface opposite the first main surface, and a side surface connecting the first main surface and the second main surface, an antenna pattern formed on at least one of the first main surface and the second main surface, and an antenna pad extending from the antenna pattern and formed on the side surface. The antenna device is welded onto a printed circuit motherboard at the antenna pad.