Antenna PCB Mounting via Multi-Board Orthogonal Configuration
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Solution Overview
Problem
Existing electronic circuits with antennas face challenges in maintaining the antenna's standing position during reflow-soldering, leading to increased production costs and size due to the need for special structure parts to prevent antenna board instability.
Innovation Solution
The use of a configuration involving multiple printed wiring boards with non-parallel orientations, where at least one board is mounted with an antenna pattern, allows for stable surface-mounting of the antenna in a standing position without requiring additional supporting structures, by connecting three printed wiring boards in a manner that ensures the antenna pattern remains upright.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an antenna pattern is formed on a rigid board or FPC, then the antenna can be attached to the main board, but an additional attachment step is required separate from the soldering step, reducing productivity
Solution Approach 1:
The patent combines the antenna pattern formation with the main board structure by forming the antenna pattern directly on the rear surface of the main board using conductive paste. This merging eliminates the need for separate antenna boards and attachment steps, integrating the antenna function into the existing PCB manufacturing and assembly process, thereby improving productivity while maintaining antenna stability.
2Stability of the object's composition
If special structure parts are added to prevent antenna board instability during reflow-soldering, then the antenna's standing position is maintained, but the device complexity and production cost increase
Solution Approach 1:
The patent extracts and eliminates the need for special supporting structure parts by forming the antenna pattern directly on the main board. The antenna pattern is created as a simple conductive trace on the rear surface, removing the complexity of separate antenna boards and their supporting structures, while still achieving stable positioning during reflow-soldering through the integrated design.
3Productivity
If an antenna pattern is formed on the main board, then productivity is enhanced by eliminating separate attachment steps, but the antenna may not maintain its standing position during reflow-soldering
Solution Approach 1:
The patent applies preliminary action by forming the antenna pattern on the rear surface of the main board before the reflow-soldering process. The conductive paste is applied and positioned in advance, creating a stable antenna structure that is already prepared to withstand the reflow-soldering process without requiring additional supporting structures during the actual soldering operation.
Data Source
AI summary
An electronic circuit includes a first printed wiring board, a second printed wiring board and a third printed wiring board. The second printed wiring board is mounted such that one edge of the second printed wiring board abuts on a part mounting surface of the first printed wiring board on which a part is mounted. The third printed wiring board is mounted such that one edge of the third printed wiring board abuts on the part mounting surface. The second and third printed wiring boards are connected to each other in a state where plate thickness directions thereof are oriented in different directions from each other about a normal line to the part mounting surface. Further, at least one of the second printed wiring board and the third printed wiring board is provided with an antenna pattern.