Antenna Module Plating Connection via Wiring Structure
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Solution Overview
Problem
Existing antenna modules face challenges in reducing size and improving performance due to signal loss associated with solder bonding, which degrades antenna performance and limits miniaturization.
Innovation Solution
The antenna module employs a wiring structure with insulating and via layers, where the antenna is connected through a plating technique instead of solder bonding, with an encapsulant covering the antenna to reduce thickness and enhance electrical connectivity, thereby improving performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder bonding is used to connect the antenna, then the antenna can be mounted on the substrate, but signal loss occurs and antenna performance is degraded
Solution Approach 1:
The patent replaces the mechanical solder bonding system with an electrical plating connection system. The antenna is electrically connected to the wiring structure through a plating layer formed on the wiring structure surface, eliminating the need for solder bonding and thereby reducing signal loss while maintaining electrical connectivity.
2Volume of moving object
If the antenna module uses traditional surface mounting, then the antenna can be installed, but the size cannot be reduced
Solution Approach 1:
The patent merges the antenna with the wiring structure by embedding the antenna directly into the wiring structure. The antenna and wiring structure are integrated into a unified component, eliminating the need for separate mounting processes and reducing the overall module size while simplifying the manufacturing process.
Solution Approach 2:
The antenna is nested within the wiring structure, with the antenna embedded in the wiring structure's internal space. This nesting approach allows the antenna to occupy the same spatial envelope as the wiring structure, significantly reducing the overall module volume while maintaining both components' functionality.
3Volume of moving object
If the antenna is embedded in the wiring structure, then the size is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies preliminary action by forming the plating layer on the wiring structure surface before embedding the antenna. This pre-prepared connection interface simplifies the subsequent antenna embedding process and ensures proper electrical connectivity is established in advance, reducing overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a reduced size and improved antenna performance by minimizing signal loss and facilitating easier embedding of the antenna, resulting in enhanced electrical connection and reduced thickness.
Implementation Method 1
an antenna may be connected to a wiring structure through a plating technique, rather than solder bonding
Data Source
AI summary
An antenna module includes a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; an antenna disposed on an upper surface of the wiring structure; and an encapsulant disposed on the upper surface of the wiring structure and covering at least a portion of the antenna. An uppermost wiring layer of the plurality of wiring layers is connected to the antenna through a connection via of an uppermost via layer of the plurality of via layers. The connection via penetrates at least a portion of the encapsulant.