Antenna Layer Recess in Semiconductor Package
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Solution Overview
Problem
Existing semiconductor package devices with integrated antennas face challenges in reducing size and manufacturing costs, as well as antenna distortion due to insufficient rigidity during molding compound formation.
Innovation Solution
A semiconductor package device design that includes a substrate, die, package body, and antenna layer, where the antenna layer is formed on the package body and extends within a recess, allowing for a compact design and reduced signal loss by direct contact with electrical contacts, while the package body surrounds the die and encapsulates electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the antenna and communication module are disposed on different parts of a circuit board and separately manufactured, then each component can be manufactured independently, but separate manufacturing costs are incurred and the device size cannot be reduced
Solution Approach 1:
The patent combines the antenna and communication module into a single integrated semiconductor package device. The antenna layer is formed as part of the package structure, extending within a recess of the encapsulant, while the communication module is mounted on the same substrate. This merging eliminates the need for separate manufacturing processes and reduces the overall device area by consolidating multiple functions into one compact unit.
2Productivity
If the antenna is made from metal stamping material, then the antenna can be formed quickly, but the antenna shape is prone to distortion because it is not firm enough to bear molding compound pressure
Solution Approach 1:
The antenna layer is nested within a recess formed in the encapsulant of the package body. This recess provides structural support and constraint for the antenna layer, preventing distortion during the molding compound formation process. The encapsulant acts as a protective container that maintains the antenna's shape while allowing rapid formation through lamination or deposition processes.
Solution Approach 2:
The patent changes the physical state and positioning parameters of the antenna by forming it as a thin layer within a recess rather than as a standalone stamped component. The recess provides mechanical support that increases the antenna's rigidity, allowing it to withstand molding pressures without shape distortion while maintaining fast formation capabilities.
3Area of stationary object
If the antenna layer is formed on the package body and extends within a recess, then the overall device size is reduced and signal loss is minimized, but the manufacturing process becomes more complex
Solution Approach 1:
The recess in the encapsulant is formed in advance before the antenna layer is deposited or laminated onto the package body. This preliminary action creates a pre-defined space that guides the antenna formation process, simplifying the subsequent steps. The recess acts as a template that ensures proper antenna positioning and shape, reducing the complexity of alignment and formation operations.
4Loss of energy
If the antenna layer directly contacts electrical contacts, then signal loss is minimized, but the antenna structure becomes more integrated and harder to manufacture separately
Solution Approach 1:
The antenna layer is merged with the package body structure and directly contacts the electrical contacts on the substrate. This integration eliminates intermediate connection interfaces that would cause signal loss, creating a direct electrical pathway. The antenna becomes an intrinsic part of the package device rather than a separate component, optimizing signal transmission while maintaining manufacturability through integrated processing steps.
Data Source
AI summary
A semiconductor package device comprises a substrate, a die, an encapsulant and an antenna layer. The substrate has a top surface and a bottom surface opposite to the top surface. The die is disposed on the top surface of the substrate. The encapsulant is disposed on the top surface of the substrate and surrounds the die. The encapsulant has a top surface and defines a recess on the top surface of the encapsulant. The antenna layer is disposed on the top surface of the encapsulant and extends within the recess on the top surface of the encapsulant.