Integrated Antenna Package Structure for Multi-Chip Thermal Management
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Solution Overview
Problem
The existing package structure of chip-based phased array antennas struggles with heat dissipation, which affects the performance of the antenna units, particularly in high-data-capacity and high-speed 5G communication applications.
Innovation Solution
An integrated antenna package structure is designed with a heat dissipation structure thermally connected to the first chip, a redistribution structure electrically connecting multiple chips, and an antenna structure, allowing for improved heat dissipation and efficient integration of multiple chips within a compact layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a conventional chip package structure is used, then the integration of multiple chips is achieved, but heat dissipation becomes difficult and affects antenna unit performance
Solution Approach 1:
The package structure is divided into multiple functional layers including first and second substrate layers, a core layer with through-holes, and multiple chip mounting positions. This segmentation allows heat to be dissipated through multiple pathways (substrate layers, through-holes) while maintaining integration of multiple chips, thus resolving the contradiction between chip quantity and heat dissipation.
Solution Approach 2:
The core layer with conductive material-filled through-holes acts as an intermediary heat transfer medium between the chips and the substrate layers. This intermediary structure facilitates efficient heat conduction from the integrated chips through the package, enabling multiple chips to be integrated without heat accumulation issues.
2Productivity
If multiple chips are integrated in a compact layout, then data capacity and transmission speed increase, but heat generated by the chips accumulates and degrades performance
Solution Approach 1:
Different regions of the package structure have different thermal properties - the core layer contains conductive material in through-holes for high heat conduction, while the substrate layers provide structural support and additional heat dissipation pathways. This local differentiation of thermal quality allows compact chip integration with effective heat management, maintaining high data transmission speed without heat accumulation.
Solution Approach 2:
The package employs composite structures including conductive materials filled in through-holes, multiple substrate layers, and interconnecting elements. This composite material approach creates multiple thermal conduction pathways that efficiently manage heat from densely integrated chips, enabling high productivity without energy loss through heat accumulation.
3Reliability
If chip density is increased to improve small cell performance, then network efficiency improves, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by incorporating through-holes penetrating the core layer and multiple substrate layers. This dimensional change creates vertical heat conduction pathways, allowing high chip density for improved small cell performance while managing heat through multiple spatial dimensions, reducing overall heat management complexity.
Solution Approach 2:
The substrate layers and core layer structure serve multiple functions simultaneously: mechanical support, electrical interconnection, and thermal management. This multi-functionality allows increased chip density for better small cell performance without proportionally increasing heat management complexity, as the same structural elements handle both support and heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation efficiency, improving the performance and reliability of antenna units by effectively managing heat generated during operation, thereby enhancing the overall performance of small cell networks in 5G communications.
Implementation Method 1
The heat dissipation structure is thermally connected to the first chip
Data Source
AI summary
An integrated antenna package structure includes a first redistribution structure, a first chip, a heat dissipation structure, a second chip, and an antenna structure. The first chip is located on a first side of the first redistribution structure, and is electrically connected to the first redistribution structure. The heat dissipation structure is thermally connected to the first chip, and the first chip is located between the heat dissipation structure and the first redistribution structure. The second chip is located on a second side of the first redistribution structure opposite to the first side, and is electrically connected to the first redistribution structure. The antenna structure is electrically connected to the first redistribution structure.