Antenna Module Resin Composition With High Dk and Mesh Passability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing thermosetting resin compositions used for antenna devices and printed wiring boards often face clogging issues when filtered through meshes, particularly when dealing with high dielectric constant materials, making large-scale industrial production challenging.
Innovation Solution
A thermosetting resin composition is developed that includes a thermosetting resin and at least one inorganic filler, such as titanium-based or zircon-based fillers, where the content of particles with a particle diameter of 1.0 μm or less in the filler is limited to 30% by volume or less, enhancing mesh passability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If high dielectric constant materials are used to increase the dielectric constant (Dk) of the substrate material, then the dielectric constant (Dk) is increased which enables downsizing of the antenna module, but the mesh passability deteriorates causing clogging during filtration
Solution Approach 1:
The patent changes the particle size parameter of the inorganic filler, specifically using particles with a diameter of 1.0 μm or less and controlling their content to 30% by volume or less. This parameter change allows the high dielectric constant material to pass through the mesh without clogging while still achieving the desired dielectric constant (Dk) of 4.0 or more, thus resolving the contradiction between increasing Dk and maintaining mesh passability
Solution Approach 2:
The patent uses a composite material system consisting of a thermosetting resin combined with specific inorganic fillers (barium titanate, strontium titanate, calcium titanate, or lead titanate) with controlled particle size distribution. This composite approach enables the material to simultaneously achieve high dielectric constant properties and good processability through the mesh filtration process
2Ease of manufacture
If the content of particles with small diameter (1.0 μm or less) is increased to improve mesh passability, then the mesh passability is improved, but the dielectric constant (Dk) decreases
Solution Approach 1:
The patent optimizes the particle size parameter by using particles of 1.0 μm or less while strictly controlling their content to 30% by volume or less of the total inorganic filler. This controlled parameter change ensures sufficient mesh passability while maintaining the high dielectric constant properties needed for antenna module downsizing
3Length of stationary object
If the content of inorganic filler is increased to maintain high dielectric constant, then the dielectric constant (Dk) is maintained, but the viscosity of the varnish increases making filtration difficult
Solution Approach 1:
The patent changes the particle size parameter of the inorganic filler to 1.0 μm or less, which significantly improves the flow characteristics and reduces the viscosity of the varnish. This allows the varnish to be filtered smoothly through the mesh even when containing a high amount of inorganic filler, thereby maintaining both the high dielectric constant and ease of filtration
Solution Approach 2:
The patent applies local quality control by specifically managing the particle size distribution of the inorganic filler, ensuring that particles are uniformly small (1.0 μm or less) throughout the composition. This localized control of particle characteristics improves the overall varnish flow and filtration properties while maintaining the desired dielectric properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent mesh passability, allowing for industrial-scale production without clogging, while maintaining high dielectric constant and low dielectric dissipation factor properties suitable for high-frequency antenna modules.
Implementation Method 1
A thermosetting resin composition used for an antenna device, a printed wiring board, and the like is generally used after being filtered with a mesh having a predetermined mesh size in order to remove a metal foreign substance and the like
Implementation Method 2
A thermosetting resin composition containing: (A) a thermosetting resin; and (B) at least one inorganic filler selected from the group consisting of a titanium-based inorganic filler and a zircon-based inorganic filler
Data Source
AI summary
To provide a thermosetting resin composition which is useful for an antenna module capable of coping with a signal in a high-frequency band and having excellent mesh passability. Specifically disclosed is a thermosetting resin composition containing (A) a thermosetting resin and (B) at least one inorganic filler selected from the group consisting of a titanium-based inorganic filler and a zircon-based inorganic filler, in which in the component (B), a content of particles having a particle diameter of 1.0 μm or less is 30% by volume or less based on the component (B). And to provide a prepreg, a resin film, a laminate, a printed wiring board, an antenna device, an antenna module, and a communication device obtained by using the thermosetting resin composition.