Integrated Antenna RF Module Layout With Fewer Substrates
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Solution Overview
Problem
The existing 5G communication system base stations require multiple antennas and RF elements, which leads to increased substrate usage and potential instability, affecting the miniaturization and reliability of antenna modules.
Innovation Solution
The antenna module design minimizes substrate usage by stacking substrates with an antenna on one layer and an RF element on another, using a shield can for electromagnetic shielding, thermal interface material for heat management, and a grid array for electrical connection, reducing the number of substrates and enhancing stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple substrates are used to mount antennas and RF elements, then the functionality and performance are improved, but the substrate count increases leading to increased size and reduced reliability
Solution Approach 1:
The patent combines multiple substrates (antenna substrate and RF element substrate) into a single integrated substrate structure. The antenna and RF element are mounted on different regions of the same substrate, eliminating the need for separate substrates and their associated mounting structures. This merging reduces the overall substrate count from multiple to one, thereby simplifying the module structure and improving reliability by reducing potential failure points at substrate interfaces.
Solution Approach 2:
The patent utilizes the surface area of a single substrate by distributing antenna elements and RF elements across different regions and layers of the substrate. By effectively using the two-dimensional surface and potentially three-dimensional stacking capabilities within the same substrate, the design accommodates multiple components without requiring additional separate substrates, thus reducing substrate count while maintaining functionality.
2Volume of moving object
If multiple substrates are stacked to accommodate antenna and RF element, then component mounting is achieved, but the module size increases and miniaturization is hindered
Solution Approach 1:
The patent merges the antenna substrate and RF element substrate into a single integrated substrate, eliminating the need for stacking multiple substrates. This consolidation directly reduces the vertical height and overall volume of the antenna module, enabling miniaturization while maintaining all necessary component mounting capabilities through strategic placement on the unified substrate.
Solution Approach 2:
The patent segments the substrate into distinct functional regions - one area for mounting antenna elements and another area for mounting RF elements. This segmentation allows different components to be mounted on the same substrate without interference, effectively utilizing the substrate area to accommodate all components in a compact single-substrate configuration rather than requiring multiple stacked substrates.
3Reliability
If directional mounting forces are applied to stacked substrates, then assembly is achieved, but failure risk increases due to force concentration
Solution Approach 1:
The patent combines multiple substrates into a single integrated substrate structure, eliminating the interfaces between stacked substrates where forces would be concentrated. With only one substrate, assembly forces are distributed across the entire substrate structure rather than being concentrated at interface points between multiple substrates, significantly reducing the risk of assembly-induced failures and improving overall structural strength and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces substrate count, improves price competitiveness, miniaturizes the antenna module, enhances reliability by reducing directional force-induced failures, and effectively manages heat, leading to improved durability.
Implementation Method 1
a shield can for electromagnetic shielding
Implementation Method 2
thermal interface material for heat management
Data Source
AI summary
A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.