Antenna Conducting Layer Protrusions for Sealant Adhesion
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Solution Overview
Problem
Antenna devices in electronic products do not fully meet consumer needs in terms of adhesion of sealant layers, leading to potential issues with moisture penetration and reduced yield.
Innovation Solution
The design incorporates a first conducting layer with protruding structures in the peripheral region, enhancing the adhesion of a sealant layer by increasing contact area and blocking moisture penetration, while also allowing for signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a flat sealant layer is used in conventional antenna devices, then the manufacturing process is simple, but the adhesion is insufficient and moisture penetration occurs
Solution Approach 1:
The sealant layer is transformed from a flat two-dimensional structure to a three-dimensional structure with protruding patterns. These protrusions extend vertically from the substrate surface, creating multiple levels of contact with adjacent layers. This dimensional transformation significantly increases the adhesion area and prevents moisture penetration paths, resolving the contradiction between simple manufacturing and effective adhesion.
Solution Approach 2:
The sealant layer incorporates protruding patterns that create a porous or textured structure. This porous configuration increases surface area for adhesion while maintaining material efficiency. The protrusions act as mechanical interlocks that enhance bonding strength without requiring additional materials or complex assembly processes.
2Reliability
If the sealant layer is made thicker to improve adhesion, then moisture resistance improves, but the device height increases and manufacturing becomes more difficult
Solution Approach 1:
Instead of increasing thickness uniformly in the vertical direction, the solution creates protruding patterns that extend upward from the substrate. This allows the sealant to provide enhanced moisture protection through increased surface area and mechanical interlocking, while the overall layer thickness remains controlled and manageable for manufacturing purposes.
Solution Approach 2:
The sealant layer is segmented into multiple protruding patterns rather than forming a single thick layer. This segmentation allows each protrusion to provide localized adhesion and moisture protection, while the collective array of protrusions achieves the desired overall reliability without requiring excessive total thickness.
3Strength
If protruding structures are added to the sealant layer to increase contact area, then adhesion improves, but the manufacturing process becomes more complex
Solution Approach 1:
The protruding patterns serve multiple functions simultaneously: they provide mechanical adhesion through increased contact area, create moisture barriers through their three-dimensional structure, and can be integrated with existing antenna device fabrication processes. This multi-functionality justifies the added manufacturing complexity by delivering multiple performance benefits from a single structural feature.
Solution Approach 2:
The protruding patterns can be manufactured by adjusting existing fabrication parameters such as photolithography patterns, etch depths, or deposition thicknesses. By changing these parameters within existing process capabilities rather than introducing entirely new manufacturing steps, the ease of manufacture is preserved while still achieving the desired adhesion improvement.
Data Source
AI summary
An electronic device includes a first substrate, a first conducting layer disposed on the first substrate, a first insulating layer disposed on the first conducting layer, a second conducting layer disposed on the first conducting layer, and a second insulating layer disposed on the first insulating layer. The second conducting layer includes a first conductive portion electrically connected to the first conducting layer through a first opening of the first insulating layer. The second insulating layer includes protruding patterns protruding from a surface of the first insulating layer. The protruding patterns include a first protruding pattern and a second protruding pattern separated from each other in a top view. In the top view, the first opening is disposed between the first protruding pattern and the second protruding pattern along a first direction, and the first conductive portion is spaced apart from the first protruding pattern and the second protruding pattern.