Antenna and Sensing Element Overlap for Interference Reduction
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Solution Overview
Problem
The challenge in mobile communication devices is to minimize mutual interference between the antenna element and the sensing element while accommodating slim design constraints, where limited hardware space leads to interference degrading communication quality.
Innovation Solution
The solution involves disposing the antenna element and the sensing element on opposite surfaces of a substrate, with their orthogonal projections overlapping and having the same shape, reducing hardware space occupation and interference. This configuration includes a sensing controller connected to the sensing element to adjust radiation power based on proximity signals, utilizing an inverted F antenna structure and a parasitic capacitor to block low-frequency signals and an inductor to manage high-frequency signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna element and sensing element are disposed close to each other to save space, then the device achieves slim design, but mutual interference occurs degrading communication quality
Solution Approach 1:
The patent applies dimensionality change by disposing the antenna element on the first surface of the substrate and the sensing element on the second surface (opposite side), utilizing the third dimension (vertical stacking) to reduce horizontal space occupation while maintaining functional separation. This allows the orthogonal projections to overlap on the same plane while physically separating the elements in the vertical dimension, thereby achieving both space efficiency and interference reduction.
Solution Approach 2:
The substrate acts as an intermediary between the antenna element and sensing element. By placing the elements on opposite surfaces of the substrate with overlapping projections, the substrate mediates the spatial relationship, enabling compact integration while maintaining electrical isolation and reducing mutual interference through the substrate's physical separation and grounding structure.
2Volume of moving object
If the antenna element and sensing element are disposed on opposite surfaces with overlapping projections, then space efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes vertical stacking on opposite surfaces of the substrate, transforming a two-dimensional layout problem into a three-dimensional solution. This approach achieves compact integration by exploiting the vertical dimension, allowing overlapping projections while maintaining physical separation, thereby improving space efficiency with manageable manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement effectively reduces mutual interference between the antenna and sensing elements, allowing for efficient communication performance in slim designs by minimizing space usage and optimizing signal management.
Implementation Method 1
The antenna element is disposed on the first surface and converts a feeding signal into an electromagnetic wave
Implementation Method 2
The sensing element is disposed on the second surface and generates a sensing signal in response to proximity of an object
Implementation Method 3
utilizing an inverted F antenna structure and a parasitic capacitor to block low-frequency signals
Implementation Method 4
and an inductor to manage high-frequency signals
Data Source
AI summary
A mobile communication device including a substrate, an antenna element and a sensing element is provided. The substrate includes a first surface and a second surface opposite to each other. The antenna element is disposed on the first surface and converts a feeding signal into an electromagnetic wave. The antenna element includes a first portion receiving the feeding signal and a second portion electrically connected to a ground. The sensing element is disposed on the second surface and generates a sensing signal in response to proximity of an object. An orthogonal projection of the sensing element on the first surface and an orthogonal projection of the second portion on the first surface are overlapped with each other and have the same shape.