Antenna Module Shield Layout for Lossy Mold Suppression
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Solution Overview
Problem
Existing antenna designs face significant loss in high-frequency applications due to the use of epoxy-based molding compounds, which degrade performance in 5G mmW and WLAN systems, while reducing or avoiding the mold leads to reduced shielding and reliability.
Innovation Solution
A conductive wall separates non-metallized and metallized molds in a multilayer substrate, connected to a ground plane and conformal shield, to suppress the lossy mold effect and maintain performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy-based molding compound is used, then shielding and reliability are improved, but system performance degrades due to lossy mold effect in high-frequency applications
Solution Approach 1:
The mold is divided into two distinct portions: a first portion made of lossy epoxy-based molding compound and a second portion made of low-loss molding compound. This segmentation allows each portion to serve different functions - the first providing shielding and reliability while the second minimizes energy loss in high-frequency applications.
Solution Approach 2:
Different regions of the mold are assigned different material properties. The first portion uses epoxy-based material with high shielding characteristics, while the second portion uses low-loss material optimized for high-frequency performance. This local differentiation resolves the contradiction by placing the right material in the right location.
2Reliability
If mold is used, then shielding is improved, but manufacturing complexity increases
Solution Approach 1:
The mold is segmented into two portions with different material compositions. The first portion uses conventional epoxy-based material while the second uses low-loss material. This segmentation enables differentiated functionality while maintaining a unified mold structure that can be manufactured using standard processes.
Solution Approach 2:
The mold combines two different materials - epoxy-based molding compound and low-loss molding compound - into a single composite structure. This composite approach provides both shielding and low-loss properties in one integrated component, avoiding the need for separate shielding structures and reducing overall manufacturing complexity.
Data Source
AI summary
An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.