Antenna Package Shielding Layout to Preserve EMI Protection and Gain
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Solution Overview
Problem
Existing methods for forming electromagnetic interference (EMI) shielding layers on antenna packages often result in overlapping or covering the antenna layers, which hinders signal transmission and reception, and the gain of the antenna is not maintained at a desired level.
Innovation Solution
The electronic device incorporates a shielding layer that is strategically positioned to cover only a portion of the carrier's lateral surface, ensuring the antenna layer is not overlapped, while maintaining a gain greater than 20 dB by using a controlled sputtering process with a supporting carrier to protect the antenna layer during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding layer is formed on the antenna package to provide EMI shielding, then electromagnetic interference protection is improved, but the antenna layer may be overlapped or covered by the shielding layer, which deteriorates signal transmission and reception performance
Solution Approach 1:
The shielding layer is segmented to cover only specific regions of the carrier that do not overlap with the antenna layer. The patterned configuration of the shielding layer allows it to provide EMI protection for non-radiating regions while leaving the antenna region exposed for optimal signal transmission.
Solution Approach 2:
The shielding layer is applied selectively to different regions of the carrier with different coverage characteristics. The non-radiating region receives full shielding coverage, while the radiating region adjacent to the antenna layer receives no shielding coverage, creating local quality differences that satisfy both EMI protection and signal transmission requirements.
2Manufacturing precision
If a tape is used to protect the antenna layer during shielding formation, then the antenna layer is protected from overlap, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The antenna layer is protected from the beginning of the shielding formation process by strategically positioning it adjacent to the first surface of the carrier, where it is naturally shielded from overlap by the carrier structure itself. This preliminary positioning eliminates the need for additional protective tapes or masks during the sputtering process.
Solution Approach 2:
The carrier structure itself serves as the protection mechanism for the antenna layer. The geometric configuration of the carrier and the strategic placement of the antenna layer create a self-protecting system where the carrier's own structure prevents shielding material from overlapping the antenna, eliminating the need for external protective elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for effective EMI shielding without obstructing the antenna's signal transmission and reception, ensuring a gain of at least 20 dB, thus enhancing the performance of the antenna package.
Implementation Method 1
using a controlled sputtering process with a supporting carrier to protect the antenna layer during manufacturing
Data Source
AI summary
An electronic device is disclosed. The electronic device includes a carrier having a first surface and a first lateral surface, an antenna adjacent to the first surface of the carrier, and a shielding layer covering a portion of the first lateral surface of the carrier. The shielding layer is configured to allow a gain of the antenna to be greater than 20 dB.