Antenna Device Solder Bonding to Prevent Substrate Deformation

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Solution Overview

Problem

Conventional antenna manufacturing methods using hot pressing can lead to deformation due to stress generated inside dielectric substrates, resulting in undesired characteristics and performance issues, especially when forming hollow structures for wide-angle beam scanning.

Innovation Solution

The use of solder bonding between dielectric substrates with through holes and patch antennas to minimize stress and prevent deformation, allowing for the creation of a hollow structure that adjusts the equivalent dielectric constant and improves radiation efficiency and gain during wide-angle beam scanning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If hot pressing is used to bond dielectric substrates, then manufacturing efficiency is improved, but stress is generated inside the substrates causing deformation

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidsubstrate deformation

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces the mechanical hot pressing system with a solder bonding system. Instead of applying heat and pressure to bond dielectric substrates, the invention uses solder material that is heated and melted to flow into gaps between substrates, then cured to form bonding. This substitution eliminates the stress generation problem caused by mechanical pressing while maintaining manufacturing efficiency.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the bonding parameters from mechanical (pressure and temperature applied during hot pressing) to chemical/thermal (solder melting temperature and curing process). By controlling the solder melting temperature and curing conditions rather than applying direct mechanical pressure, the method achieves bonding without generating internal stress that causes substrate deformation.

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If hot pressing is performed to form hollow structures, then wide-angle beam scanning capability is improved, but antenna deformation occurs due to internal stress

Engineering Contradiction:

Improvewide-angle beam scanning capabilityVSAvoidantenna deformation

Core Design Contradiction:

Adaptability or versatilityVSShape

Solution Approach 1:

The patent replaces mechanical hot pressing with solder bonding to form hollow structures. The solder material is heated, melted, and flowed into gaps between dielectric substrates to form the hollow structure, then cured. This process achieves the same structural formation capability as hot pressing but without generating internal stress that would deform the antenna elements, thereby maintaining wide-angle beam scanning capability without deformation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If dielectric material flows through gaps during hot pressing, then bonding is achieved, but hollow spaces are filled causing loss of dielectric constant adjustment

Engineering Contradiction:

Improvebonding strengthVSAvoiddielectric constant control

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent uses solder material as an intermediary substance to achieve bonding without filling hollow spaces. The solder is heated and melted to flow into gaps between substrates for bonding, then cured to form a strong bond. Because solder is applied selectively and cured in place, it bonds substrates together while leaving the hollow spaces intact, thereby preserving the dielectric constant adjustment capability that depends on those hollow structures.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach prevents antenna deformation and enhances radiation efficiency and gain by minimizing stress between dielectric substrates, effectively addressing the limitations of hot pressing methods and improving performance in wide-angle scanning applications.

Implementation Method 1

the first conductor ground plane of the first dielectric substrate and the second conductor ground plane of the second dielectric substrate are bonded by a first solder, and the third conductor ground plane of the second dielectric substrate and the fourth conductor ground plane of the third dielectric substrate are bonded by a second solder

Methodology Applied

Scientific EffectSolder bonding: Soldering

Data Source

PatentUS11621482B2Antenna manufacturing method and antenna device

Publication Date: 2023.04.04 MITSUBISHI ELECTRIC CORP

AI summary

A conductor ground plane provided on a dielectric substrate and provided with a patch antenna and a conductor ground plane provided on the side of a dielectric substrate having a through hole are bonded by solder in a state where the through hole and the patch antenna are arranged to face each other, and a conductor ground plane provided on the back side of the dielectric substrate and a conductor ground plane provided on a dielectric substrate are bonded by solder.