Integrated Antenna Stack With Waveguide Channel RF Coupling
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Solution Overview
Problem
Conventional antenna modules suffer from signal quality loss due to assembly misalignments, increased size, and mechanical instability, particularly in RF applications, and lack efficient electromagnetic interference protection.
Innovation Solution
A compact antenna assembly is created by integrating a component carrier stack with an embedded RF component and conductive layer structure, directly coupling electromagnetic waves into a channel within an antenna structure, using a metallized waveguide channel and etched metal structures for precise alignment and enhanced signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conventional waveguide antennas are assembled onto circuit boards with distance separation, then mechanical stability is improved, but signal quality deteriorates due to unavoidable signal losses
Solution Approach 1:
The patent merges the waveguide antenna and circuit board into a single integrated structure where the waveguide channels are formed directly within the circuit board substrate. This eliminates the separate assembly of distant components while maintaining mechanical stability through unified construction.
Solution Approach 2:
The waveguide channels are nested within the circuit board substrate itself, with the antenna structure embedded inside the board. This nesting approach allows the antenna to be positioned at optimal distances from circuit elements while maintaining structural integrity.
2Loss of energy
If launchers are applied on package-level to feed RF signals into waveguide, then signal quality is improved, but device complexity increases due to assembly misalignments
Solution Approach 1:
The launcher structure is merged with the circuit board and waveguide assembly, forming an integrated feed mechanism. The conductive traces on the circuit board directly transition into the waveguide channels, eliminating separate launcher components and their associated alignment issues.
Solution Approach 2:
The waveguide channels and launcher structures are pre-formed within the circuit board during manufacturing, with precise positioning established before final assembly. This preliminary structuring eliminates alignment problems that would occur during later assembly steps.
3Loss of energy
If launcher structures are applied on conventional chip packages, then RF signal transmission is improved, but package size increases significantly
Solution Approach 1:
The waveguide channels extend in the vertical dimension through the circuit board thickness, allowing compact horizontal footprint while maintaining effective RF transmission paths. This three-dimensional arrangement reduces overall package size compared to planar launcher structures.
Solution Approach 2:
The launcher and waveguide structures are nested within the circuit board substrate volume, utilizing the board's thickness dimension. This nesting approach maintains RF performance while minimizing the horizontal package footprint.
4Loss of energy
If through-holes with metallized sidewalls are used to elongate waveguide channels, then signal transmission is improved, but manufacturing precision requirements increase
Solution Approach 1:
The through-holes and waveguide channels are merged into a single integrated structure formed during circuit board manufacturing. The metallized sidewalls are applied as part of the standard PCB fabrication process, eliminating separate precision alignment steps.
Solution Approach 2:
The waveguide channel geometry and metallization are pre-established during circuit board lamination and fabrication, before any assembly operations. This preliminary formation ensures consistent dimensions and positioning without requiring high-precision alignment during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces package size, improves RF performance, enhances mechanical stability, and minimizes signal losses while providing efficient electromagnetic shielding and thermal management.
Implementation Method 1
the launcher emits the RF signal and thereby feeds said RF signal via the through-holes into the waveguide channels
Implementation Method 2
The waveguide channels elongate through the circuit board and the antenna waveguide module. The sidewalls of the through-holes and/or waveguide are metallized
Data Source
AI summary
An antenna assembly includes a stack and an antenna structure. The stack includes at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a component, at least partially embedded in the stack. At least a portion of the electrically conductive layer structure is provided at the external side of the stack and is configured to act at least as part of an electromagnetic wave coupling structure. The component is coupled to the electromagnetic wave coupling structure. The antenna structure provides an opening to a channel. The stack and the antenna structure are connected so that the electromagnetic wave coupling structure and the opening to the channel face each other.