Antenna Subarray With Ancillary Boards For Low Elevation Gain
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Solution Overview
Problem
Conventional wideband Electronically Scanned Arrays (ESAs) are heavy, costly, and have limited field of view at low elevation angles, requiring increased signal strength to maintain communication with aircraft or orbital systems, which is inefficient.
Innovation Solution
The development of an antenna subarray using printed circuit board assemblies (PCBAs) with soldered connections between patterned conductive layers and antenna elements, allowing for simpler construction and higher gain at low elevation angles through the use of ancillary boards and radiating elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional ESA designs use connectors and cables to assemble antenna elements, then the antenna array can be constructed, but the system becomes heavy and costly
Solution Approach 1:
The patent merges the antenna element and its connection structure into a single integrated PCB assembly. The radiating elements are directly mounted on the PCB substrate with integrated ground connections, eliminating the need for separate connectors and cables. This integration reduces weight while maintaining reliable electrical connections through the PCB's inherent conductive pathways.
Solution Approach 2:
The patent replaces mechanical connector systems with electrical connections through the PCB trace network. Instead of using physical connectors and cables to join antenna elements, the design uses the PCB's conductive layers to provide both mechanical support and electrical connectivity, thereby reducing mechanical complexity and weight.
2Reliability
If conventional ESA designs use connectors for each antenna element, then the antenna array can be assembled, but the manufacturing becomes complex and costly
Solution Approach 1:
The antenna element mounting structure and electrical connection path are merged into a single PCB assembly. The radiating elements are mounted directly on the PCB with their ground connections established through the substrate, eliminating the need for separate connector assemblies and simplifying the manufacturing process to standard PCB fabrication and mounting techniques.
Solution Approach 2:
The patent segments the antenna array into modular PCB subarrays that can be independently fabricated and then integrated. Each PCB module contains complete antenna elements with integrated connections, allowing for standardized manufacturing and assembly while maintaining reliable electrical connections through the PCB's conductive pathways.
3Device complexity
If conventional ESAs use planar configuration, then the antenna structure is simple, but the field of view at low elevation angles is limited with reduced gain
Solution Approach 1:
The patent transitions from a two-dimensional planar antenna array to a three-dimensional configuration by mounting radiating elements at angles relative to the PCB substrate. This dimensional change allows the antenna elements to project signal energy toward low elevation angles while maintaining the simplicity of the PCB-based structural support.
Solution Approach 2:
The patent applies different orientations and configurations to different regions of the antenna array. By varying the mounting angles and positions of radiating elements across the PCB surface, the design creates localized radiation patterns that collectively improve coverage at low elevation angles while maintaining overall structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved reliability and construction simplicity while achieving higher signal strength at lower elevation angles, enhancing communication efficiency with aircraft or orbital systems.
Implementation Method 1
a second antenna element coupled to the second substrate and coupled through a soldered connection to the patterned conductive layer
Data Source
AI summary
An antenna subarray is disclosed that includes a main board comprising a first substrate, a patterned conductive layer coupled to the first substrate, and a first antenna element coupled to the first substrate. The subarray also includes at least one ancillary board comprising a second substrate coupled to and extending outward from the first substrate and a second antenna element coupled to the second substrate and coupled through a soldered connection to the patterned conductive layer.


