Antenna Substrate Bonding for Positional Accuracy
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Solution Overview
Problem
Existing antenna substrates face challenges in maintaining stable transmission and reception of electromagnetic waves due to poor positional accuracy of first and second antenna conductors.
Innovation Solution
The antenna substrate comprises a cap substrate with first antenna conductors, a frame substrate with openings, and a base substrate with second antenna conductors, bonded using a second bonding member with high adhesive strength and a first bonding member with lower adhesive strength to achieve precise positioning and stable wave transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If mounting substrates are bonded to the spacer with solder or adhesive, then the antenna substrate can be assembled, but the positional accuracy of the antenna conductors deteriorates
Solution Approach 1:
The bonding member is divided into two distinct parts: a first bonding member (adhesive layer) that provides temporary bonding and allows position adjustment, and a second bonding member (solder or rigid adhesive) that provides strong final bonding. This segmentation allows the assembly process to benefit from both easy adjustment and strong fixation.
Solution Approach 2:
The first bonding member is applied first to enable preliminary positioning and adjustment of the mounting substrates relative to the spacer. This preliminary action allows the antenna conductors to be positioned accurately before the second bonding member is applied to secure the final position.
2Strength
If a single strong bonding member is used to firmly bond mounting substrates, then bonding strength is improved, but positional adjustability deteriorates
Solution Approach 1:
The bonding system is segmented into two functional parts: the first bonding member (adhesive) that provides initial bonding with some flexibility for adjustment, and the second bonding member (solder or rigid adhesive) that provides strong final bonding. This segmentation resolves the contradiction by providing both adjustability and strength at different stages.
Solution Approach 2:
The bonding system transitions from a dynamic state (allowing position adjustment with the first bonding member) to a fixed state (with the second bonding member). This dynamic approach allows the system to adapt to positioning requirements during assembly and then secure the final position with high strength.
3Ease of operation
If mounting substrates are loosely bonded, then positional adjustment is easier, but bonding reliability deteriorates
Solution Approach 1:
The bonding process is segmented into two stages: first bonding with the adhesive layer that allows adjustment, then second bonding with solder or rigid adhesive that ensures reliability. This segmentation ensures both ease of adjustment and bonding reliability are achieved at appropriate stages.
Solution Approach 2:
The first bonding member is applied as a preliminary step to enable position adjustment before final bonding. This preliminary bonding provides enough holding force to maintain position during adjustment while still allowing repositioning, and is later reinforced by the second bonding member for reliable final fixation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures high positional accuracy between the antenna conductors, enabling stable transmission and reception of electromagnetic waves by maintaining a consistent distance between them.
Implementation Method 1
The cap substrate and the base substrate, and the frame substrate are firmly bonded to each other by a second bonding member (23) having a large adhesive strength while the position is modified through the bonding with a first bonding member (15) having a relatively small adhesive strength
Data Source
Figure 1A~1B
Figure 2~3A
Figure 3B~3D
AI summary
The present disclosure includes a cap substrate 10 including a first antenna conductor 12 located on upper and lower surfaces of a first insulating layer 11; a frame substrate 20 including an opening 22 located in the second insulating layer 21 and having an outer periphery that surrounds an individual of or a collective number of outer peripheries of the plurality of first antenna conductors 12 in a top view; a base substrate 30 including a second antenna conductor 32 located on an upper surface of a third insulating layer 31; a first adhesive material 14 adhering the first insulating layer 11 and the second insulating layer 21; and a second adhesive material 23 adhering the second insulating layer 21 and the third insulating layer 31; and the first adhesive material 14 and the second adhesive material 23 include a first bonding member 15 and a second bonding member 16 having an adhesive strength to the second insulating layer 21 greater than that of the first bonding member 15.