Phased Antenna Substrate Layout for Lower Dielectric Loss
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Solution Overview
Problem
Existing electronic devices with antenna capabilities face limitations in performance and operational reliability due to inadequate structural designs, particularly in terms of dielectric loss and susceptibility to temperature-induced deterioration.
Innovation Solution
The proposed antenna device incorporates a first substrate with phase shifters, a second substrate, patches, and an insulating layer, where the insulating layer's thickness is between 5 μm and the thickness of the second substrate, reducing dielectric loss and improving reliability by forming a patch and common electrode on the same side of the substrate, thus minimizing the risk of substrate cracks and deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the insulating layer thickness is increased, then dielectric loss is reduced, but the device complexity increases
Solution Approach 1:
The patent applies parameter changes by optimizing the insulating layer thickness to a specific range (5 μm to 20 μm) to reduce dielectric loss. This quantitative parameter adjustment directly addresses the energy loss issue while maintaining manufacturability, resolving the contradiction between reducing loss and avoiding excessive complexity.
2Reliability
If multiple layers are stacked to improve antenna performance, then reliability improves, but susceptibility to temperature-induced deterioration increases
Solution Approach 1:
The patent introduces an insulating layer as an intermediary component between the first and second substrates. This intermediate layer acts as a buffer that reduces thermal stress transmission between layers, preventing temperature-induced deterioration while maintaining the reliability benefits of multi-layer construction.
Solution Approach 2:
The patent employs composite material structure by combining different materials with complementary properties: the insulating layer material is selected to have thermal expansion characteristics that match both substrates, creating a composite structure that resists temperature-induced stress and improves reliability under thermal conditions.
3Device complexity
If the insulating layer thickness is decreased, then device complexity is reduced, but dielectric loss increases
Solution Approach 1:
The patent establishes a minimum thickness parameter of 5 μm for the insulating layer, below which dielectric loss becomes unacceptable. This parameter boundary definition provides a clear design guideline that balances simplicity and performance, avoiding unnecessary complexity while preventing energy loss.
Data Source
AI summary
An antenna device is provided. The antenna device includes a first substrate, a plurality of phase shifters, a second substrate, a plurality of patches and an insulating layer. The plurality of phase shifters are disposed on the first substrate. The second substrate is disposed on the first substrate. The plurality of patches are disposed between the first substrate and the second substrate. The insulating layer is disposed between the plurality of phase shifters and the second substrate. Moreover, a thickness of the insulating layer is greater than or equal to 5 μm and less than or equal to a thickness of the second substrate.