Liquid Crystal Antenna Substrate Layout for Floating Pin Elimination
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Solution Overview
Problem
In existing communication technologies, when the number of pins in a drive chip exceeds the number of pins in a substrate, some pins in the drive chip remain floating, affecting performance and requiring multiple drive chips for substrates with different pin configurations, increasing fabrication costs.
Innovation Solution
A substrate module with a first substrate featuring a first sub-region and a second sub-region, where the second sub-region includes a binding region with first and second sub-pins electrically connected to loads, including capacitors, allowing extra pins in the drive chip to be connected to second sub-pins, preventing floating states and enabling broader application scope without needing multiple drive chip variants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of pins in the drive chip is greater than the number of pins in the substrate, then the drive chip can provide more connection points, but some pins in the drive chip remain floating, affecting performance
Solution Approach 1:
The substrate is designed with two types of pins: first pins for connecting to drive chip pins, and second pins for connecting to loads. This universal pin structure allows the same substrate to accommodate drive chips with different numbers of pins, enabling pins with different configurations to serve multiple functions - either connecting to drive chip pins or connecting to loads, thus preventing floating pins while maintaining performance
Solution Approach 2:
The second pins on the substrate act as an intermediary between the drive chip pins and the loads. When a drive chip pin cannot be connected to a corresponding first pin, it can be connected to a second pin instead, which then provides the necessary electrical connection to the load, preventing the floating state while maintaining system functionality
2Reliability
If multiple drive chips are used for substrates with different pin configurations, then each substrate can have optimal pin matching, but fabrication costs increase
Solution Approach 1:
The substrate incorporates both first pins and second pins with the same structural design, allowing a single standardized drive chip to be used across different substrate configurations. The second pins provide alternative connection points that maintain electrical connectivity without requiring specialized drive chip variants, thereby reducing fabrication costs while preserving connection reliability
Solution Approach 2:
The substrate design allows for variable configurations of first and second pins without changing the fundamental structure or requiring different drive chip models. By adjusting the number and arrangement of pin types on the substrate side, the system adapts to different connection requirements while using the same drive chip, reducing manufacturing complexity and cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively connects all pins in the drive chip, improving performance by preventing floating pins and reducing fabrication costs by allowing a single drive chip to be used across substrates with varying pin configurations.
Implementation Method 1
the second load includes a capacitor including a first capacitor; the first substrate includes a first base substrate, and further includes a first electrode layer, a first insulating layer and a second electrode layer which are sequentially arranged on a side of the first base substrate; the first electrode layer includes a first electrode portion; the second electrode layer includes a second electrode portion; and the second electrode portion is electrically connected to the second sub-pin; and along a direction perpendicular to a plane of the base substrate, the first electrode portion is at least partially overlapped with the second electrode portion; and an overlapping portion of the first electrode portion and the second electrode portion forms the first capacitor
Data Source
AI summary
A substrate module, a display apparatus, and a liquid crystal antenna are provided in the present disclosure. The substrate module includes a first substrate. The first substrate includes a first sub-region and a second sub-region; the second sub-region includes a binding region; and the binding region includes first pins. The first sub-region includes first loads, and a first sub-pin is electrically connected to the first load. The second sub-region includes at least one second load, and a second sub-pin is electrically connected to the second load. The second load includes a capacitor including a first capacitor. The first substrate includes a first base substrate, a first electrode layer, a first insulating layer and a second electrode layer. Along a direction perpendicular to a plane of the base substrate, an overlapping portion of a first electrode portion and a second electrode portion forms the first capacitor.