Antenna Substrate Layout With Core Power Wiring and Ground Shielding
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Solution Overview
Problem
The increase in the number of buildup layers in antenna substrates for high-frequency ICs leads to higher manufacturing costs and reduced reliability due to dimensional errors, especially when used in millimeter wave bands.
Innovation Solution
The antenna substrate design includes a core layer with integrated power-supply wiring and a ground layer, reducing the number of buildup layers by using through-hole vias to connect the high-frequency IC and power-supply wiring within the core layer, while ensuring a sufficient thickness between the antenna and ground layer to minimize electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of buildup layers is increased to accommodate more signal lines and power-supply wiring, then the functionality and integration are improved, but the manufacturing cost increases and reliability decreases due to accumulation of dimensional errors
Solution Approach 1:
The invention moves power-supply wiring from the vertical stacking direction (buildup layers) to the horizontal plane (inner layer of core layer), allowing electrical connection through through-hole vias. This dimensional transformation reduces the number of buildup layers needed while maintaining power supply functionality, thereby improving reliability without sacrificing adaptability.
2Adaptability or versatility
If the number of buildup layers is increased to accommodate more signal lines and power-supply wiring, then the functionality and integration are improved, but the manufacturing cost increases
Solution Approach 1:
By relocating power-supply wiring to the inner layer of the core layer and establishing vertical electrical connection through through-hole vias, the invention reduces the number of buildup layers required. This simplification of the layered structure directly reduces manufacturing complexity and cost while preserving the necessary functionality.
3Length of stationary object
If the ground layer is positioned close to the antenna, then the substrate thickness is reduced, but electromagnetic wave leakage to the power-supply wiring layer increases
Solution Approach 1:
The invention extracts the power-supply wiring layer from the vicinity of the antenna by positioning it in the inner layer of the core layer, separated from the antenna by the ground layer. This spatial separation eliminates electromagnetic interference between the antenna and power-supply wiring while maintaining compact substrate thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability and reduces manufacturing costs by maintaining effective electromagnetic coupling while minimizing electromagnetic wave leakage and improving antenna performance.
Implementation Method 1
a first through-hole via configured to pass through the core layer in the thickness direction from the one surface to the other surface and electrically connect the power-supply wiring layer and the high-frequency IC
Implementation Method 2
the ground layer is provided inside the core layer, and the power-supply wiring layer is arranged on the opposite side of the antenna with respect to the ground layer. Thereby, electromagnetic wave leakage from the antenna to the power-supply wiring layer can be suppressed
Data Source
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AI summary
According to the present invention, an antenna substrate includes a core layer, a first buildup layer laminated on one surface of the core layer and a second buildup layer laminated on the other surface of the core layer. An antenna is formed on the first buildup layer. A high-frequency integrated circuit (IC) is mounted on the second buildup layer. A ground layer formed away from the antenna in a thickness direction and a power-supply wiring layer formed on an opposite side of the antenna with respect to the ground layer in the thickness direction are provided in an inner layer of the core layer. The core layer includes a first through-hole via configured to pass through the core layer in the thickness direction from the one surface to the other surface and electrically connect the power-supply wiring layer and the high-frequency integrated circuit (IC).