Antenna Substrate on Semiconductor Device for Yield Improvement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages with integrated antenna and communication modules suffer from reduced yield and increased costs due to the need to discard entire chips when either the antenna or communication module portion is defective.
Innovation Solution
A semiconductor package design that includes a package substrate, a semiconductor device, and an antenna substrate directly disposed on the semiconductor device, with a grounding layer to reduce electromagnetic interference and allow for separate testing of the antenna substrate, thereby improving yield and reducing costs by enabling the identification of defective substrates before integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the antenna layer and communication module are integrated into a single chip, then the device achieves compact integration, but the entire chip must be discarded when either portion is defective, reducing yield and increasing costs
Solution Approach 1:
The patent divides the integrated wireless communication device into separate substrates: an antenna substrate containing the antenna layer and a communication module substrate containing the communication module. This segmentation allows independent testing and replacement of each substrate, so that a defect in one does not necessitate discarding the entire device, thereby improving manufacturing yield while maintaining integration benefits.
2Device complexity
If the antenna substrate is directly integrated with the communication module, then device complexity is reduced, but separate testing of antenna and communication module becomes difficult
Solution Approach 1:
By segmenting the device into separate antenna substrate and communication module substrate, the patent enables independent testing of each component before final assembly. The antenna substrate can be tested for RF performance independently, and the communication module substrate can be tested for processing functionality independently, significantly reducing testing difficulty while maintaining relatively simple overall device structure.
3Reliability
If the entire chip is discarded when one portion is defective, then quality control is simplified, but material waste increases and costs rise
Solution Approach 1:
The patent segments the integrated device into replaceable substrates, allowing only the defective substrate to be discarded rather than the entire chip. This maintains quality control through independent substrate testing while significantly reducing material waste and costs by preserving functional portions of the device.
Solution Approach 2:
The patent enables selective discarding of only the defective substrate while recovering and reusing the functional substrate. This approach maintains reliability standards by ensuring only tested-good substrates are assembled, while minimizing material waste and reducing production costs through component recovery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances yield and reduces costs by allowing for the separate testing of antenna substrates, ensuring only functional components are integrated, thus minimizing waste and optimizing production efficiency.
Implementation Method 1
an antenna substrate disposed on the inactive surface of the semiconductor device
Data Source
AI summary
A semiconductor package includes: (1) a package substrate including an upper surface; (2) a semiconductor device disposed adjacent to the upper surface of the package substrate, the semiconductor device including an inactive surface; and (3) an antenna substrate disposed on the inactive surface of the semiconductor device.