Antenna Substrate With Side-Exposed Pad Layers for 5G Modules
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Solution Overview
Problem
Current antenna substrates for 5G communications face challenges in achieving a vertical structure without using separate cable substrates, leading to signal loss and increased costs due to the need for connectors and flexible printed circuit cable boards.
Innovation Solution
The antenna substrate design includes a body with an antenna portion on one surface and a pad portion exposed on the side surface, featuring multiple pad layers with pattern and via layers that are wider in one direction, allowing for direct mounting and eliminating the need for separate cable substrates, thus enabling a vertical antenna structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If separate cable substrates and connectors are used to achieve vertical antenna structure, then the antenna can be mounted vertically, but signal loss increases and costs increase
Solution Approach 1:
The patent merges the cable substrate function into the antenna substrate itself by integrating multiple pad layers (first pad layer, second pad layer, third pad layer) with pattern layers and via layers directly within the antenna substrate body. This eliminates the need for separate cable substrates and connectors, thereby reducing signal loss while achieving the vertical antenna structure.
2Shape
If separate cable substrates and connectors are used, then vertical mounting is enabled, but device complexity and costs increase
Solution Approach 1:
The invention combines multiple functional layers (pattern layers, via layers, pad layers) into a single integrated antenna substrate structure. The first pad layer is disposed in the body with vias extending through, the second pad layer is on the front surface, and the third pad layer connects them, all within the same substrate without requiring separate cable substrates or connectors.
Solution Approach 2:
The antenna substrate serves multiple functions simultaneously: it provides the antenna structure, the mounting substrate, the connection interface, and the vertical orientation capability all in one component, eliminating the need for separate specialized components for each function.
3Ease of manufacture
If traditional substrate design is used, then manufacturing is simpler, but direct mounting capability is reduced
Solution Approach 1:
The patent utilizes the vertical dimension by extending vias through the substrate body and positioning pad layers at different depths and orientations. The first pad layer is disposed within the body, the second pad layer on the front surface, and the third pad layer connects them vertically, enabling direct mounting capability while maintaining manufacturability through standard layered fabrication processes.
Data Source
AI summary
An antenna substrate includes: a body having a first surface and a second surface opposing each other and a side surface connecting the first surface and the second surface to each other; an antenna portion disposed on the first surface of the body; and a pad portion disposed in the body, exposed to the side surface of the body, and including a plurality of pad layers connected to each other in a first direction from the second surface of the body toward the first surface of the body. At least one of the plurality of pad layers has a greater width in a second direction than in a third direction perpendicular to the second direction when viewed in the first direction.