Antenna System With 3D Dielectric Substrate
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Solution Overview
Problem
Conventional antenna systems face performance deterioration due to interference from circuit components and increased manufacturing costs associated with separating the electric power feeding element and the radiating element, which are typically positioned on the same layer of a circuit board.
Innovation Solution
The antenna system is designed with a three-dimensional configuration where the radiating element is formed on a dielectric substrate positioned above the circuit board, with the feed element within the outer periphery of the radiating element, and conductive elements connecting them to the feed circuit and ground terminal, respectively, allowing for capacitive coupling and reduced interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the feed element and radiating element are positioned on the same layer of the circuit board, then manufacturing is simpler, but antenna performance deteriorates due to interference from circuit components
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional configuration by positioning the radiating element on a dielectric substrate above the circuit board while placing the feed element on the circuit board itself. This vertical separation in the Z-direction eliminates interference from circuit components while maintaining manufacturing feasibility through standard PCB and substrate assembly processes.
2Reliability
If a resin layer is provided above the circuit board to separate the radiating element and feed element, then interference from circuit elements is avoided, but device thickness increases and manufacturing costs increase
Solution Approach 1:
The patent divides the antenna system into two distinct functional segments: the feed element remaining on the circuit board and the radiating element positioned on a separate dielectric substrate. This segmentation allows each component to be optimized independently and assembled in three-dimensional space, avoiding the need for a thick resin layer while maintaining interference avoidance.
3Reliability
If the radiating element is positioned around the feed element with adjustable capacitive coupling, then antenna performance can be optimized, but manufacturing precision requirements increase
Solution Approach 1:
By moving the radiating element to a higher Z-level on a separate dielectric substrate, the patent creates additional design freedom in the vertical dimension. This allows optimization of capacitive coupling through vertical positioning and substrate thickness adjustments rather than relying solely on precise lateral positioning, thereby reducing manufacturing precision requirements while maintaining performance optimization capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes interference from circuit components, maintains low manufacturing costs, and provides flexibility in designing the antenna system by adjusting the capacitive coupling value, enhancing the overall performance and efficiency of the antenna.
Implementation Method 1
the electric power feeding element and the radiating element are positioned in such a manner, such that they at least partially overlap, thereby creating a capacitive coupling. The radiating element thereby emits the current transmitted from the power feed element as a radio wave through this capacitive coupling.
Data Source
AI summary
Discussed herein is an antenna system that comprises a feed element and a radiating element that are formed on a dielectric substrate positioned above a circuit board which includes a feed circuit and a ground layer. Specifically, the feed element is disposed within an outer periphery defined by the radiating element. A capacitive coupling is formed between the feed element and the radiating element. With the aforesaid configuration, the antenna system is less affected by the circuit board and interference from other elements that are mounted on the circuit board. Further, manufacturing costs are reduced as compared to the case where the feed element and the radiating element are respectively formed on a front and rear surface of a resin layer.