Antenna Tile Ground Cavities Integrated into Support Structure

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Phased array antenna tile designs are hindered by high manufacturing costs and excessive mass, making them non-viable due to the use of expensive customized composite structures and separate ground-resonating cavity boxes.

Innovation Solution

Integrating resonating ground cavities into the support structure of the antenna tile, which reduces the need for additional parts and simplifies assembly, and using a stock aluminum honeycomb support structure to lower costs and mass, while improving thermal efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate ground-resonating cavity boxes are used in antenna tile designs, then antenna performance is maintained, but manufacturing cost and mass increase significantly

Engineering Contradiction:
Improveantenna performanceVSAvoidantenna tile mass
Core Design Contradiction:
ReliabilityVSWeight of stationary object

Solution Approach 1:

The patent merges the ground-resonating cavity boxes with the support structure into a single integrated component. The support structure includes integrated ground cavities that serve both structural support and electromagnetic resonance functions, eliminating the need for separate cavity boxes. This integration maintains antenna performance while significantly reducing mass and manufacturing cost.

Inventive Principle:
Principle #5Merging (Combining)

2Strength

If customized composite support structures are used in antenna tiles, then structural requirements are met, but manufacturing cost increases by 90%

Engineering Contradiction:
Improvesupport structure capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The patent creates a universal support structure that serves multiple functions: mechanical support, thermal management, and electromagnetic resonance. The aluminum honeycomb structure with integrated ground cavities replaces customized composite structures, providing the same structural capability while being manufactured from standard materials and processes, reducing cost by 90%.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If multiple separate components are used in antenna tiles, then functional requirements are met, but assembly complexity and time increase

Engineering Contradiction:
Improvefunctional performanceVSAvoidassembly process
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple separate components (support structure and ground-resonating cavity boxes) into a single integrated support structure with built-in ground cavities. This reduction in part count simplifies the assembly process, eliminates alignment issues between separate components, and reduces assembly time while maintaining all required functional performance.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces the overall cost and mass of the antenna tile by 90% and simplifies the assembly process, enhancing both performance and efficiency.

Implementation Method 1

The one or more ground cavities may resonate standing waves

Methodology Applied
Scientific EffectResonance: Resonance

Data Source

PatentUS8525729B1Antenna tiles with ground cavities integrated into support structure
Publication Date: 2013.09.03 LOCKHEED MARTIN CORP
  • US8525729B1 patent drawing
  • US8525729B1 patent drawing
  • US8525729B1 patent drawing

AI summary

Examples of an antenna tile and a method of manufacturing the same are provided. An antenna tile may include one or more antenna patch elements, a circuit board, and a support structure. The one or more antenna patch elements may radiate radio frequency (RF) signals, and each of the one or more antenna patch elements may include a conductive layer. The circuit board may be disposed between the one or more antenna patch elements and the support structure. The support structure may include one or more ground cavities. The one or more ground cavities may be integrated into the support structure and may be electrically conductive. The one or more ground cavities may resonate standing waves, and the one or more ground cavities may be disposed below the respective one or more antenna patch elements.