Antenna Device Via Arrangement for High-Frequency Operation
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Solution Overview
Problem
The challenge in manufacturing antenna devices is the difficulty in maintaining the separation of lands for feeding and short-circuit vias at high operating frequencies, which can lead to contact issues and restricted current paths, limiting the antenna's frequency range and manufacturing feasibility.
Innovation Solution
The antenna device incorporates a ground plate, a patch section, a plurality of first short-circuit vias arranged on a circumference, and at least one second short-circuit via, where the second via provides additional current paths, increasing the operating frequency range by forming an LC parallel resonance circuit with the patch section and ground plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the operating frequency is increased, then the antenna performance is improved, but the land separation between feeding and short-circuit vias becomes difficult to maintain
Solution Approach 1:
The patent divides the short-circuit vias into two separate groups: first short-circuit vias arranged on a circumference at a first radius from the center, and second short-circuit vias arranged on a different circumference at a second radius. This segmentation allows each group to serve specific current path functions, maintaining proper land separation even at high operating frequencies where compact designs are required.
Solution Approach 2:
The patent transitions from a single-circumference arrangement to a two-dimensional radial arrangement with multiple circumferences at different radii. This dimensional change in the via arrangement pattern enables better spatial separation of lands while accommodating high-frequency operation requirements.
2Adaptability or versatility
If the number of current paths is increased, then the operating frequency range is broadened, but the device complexity increases
Solution Approach 1:
The patent segments the short-circuit vias into first and second groups with different arrangements, where each group contributes to creating multiple current paths. This segmentation broadens the operating frequency range while maintaining a systematic and manageable structure rather than creating random complexity.
Solution Approach 2:
Both the first and second short-circuit vias perform the same fundamental function of providing current paths between the ground plate and patch section, but at different radial positions. This multi-functionality with a single design pattern (multiple circumferential rings) avoids excessive complexity while achieving broad frequency operation.
3Speed
If the via arrangement is optimized for high frequency, then the operating frequency range is improved, but the manufacturing feasibility decreases
Solution Approach 1:
By segmenting short-circuit vias into first and second groups at different radii, the patent creates clearly defined separation zones that are easier to manufacture with standard PCB drilling and plating processes, even at high frequencies where compact designs are needed.
Solution Approach 2:
The patent applies different radial positioning (local quality) to different groups of short-circuit vias, with first vias at one radius and second vias at another radius. This local differentiation optimizes each via group's position for both high-frequency performance and manufacturability with standard processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration broadens the operating frequency band and reduces the risk of land contact between vias, enhancing the antenna's performance and manufacturing ease by increasing the number of current paths and adjusting resonance frequencies.
Implementation Method 1
Each of the first short-circuit vias has an axial center disposed on a circumference of a via arrangement circle positioned at a center portion of the patch section, and has a first end connected with the patch section and a second end connected with the ground plate. The second short-circuit via has an axial center at a position different from the circumference of the via arrangement circle, and has a first end connected with the patch section a second end connected with the ground plate.
Implementation Method 2
The second via provides additional current paths, increasing the operating frequency range by forming an LC parallel resonance circuit with the patch section and ground plate.
Data Source
AI summary
An antenna device includes a ground plate that is a conductive member having a plate shape, a patch section that is a conductive member having a plate shape and is disposed in parallel with the ground plate with a predetermined interval so as to face the ground plate, a plurality of first short-circuit vias each having an axial center disposed on a circumference of a via arrangement circle located in a center portion of the patch section and each having a first end connected with the patch section and a second end connected with the ground plate, and at least one second short-circuit via having an axial center disposed at a position different from the circumference of the via arrangement circle and having a first end connected with the patch section and a second end connected with the ground plate.