Antenna Device Via Conductor Stacking
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Solution Overview
Problem
Existing antenna devices with wide communicable angular ranges face challenges in miniaturization and cost-effective manufacturing due to complex manufacturing processes and the need for multiple laminates with different lamination directions.
Innovation Solution
An antenna device with a substrate structure featuring insulating layers laminated in a specific direction, including ground and radiating conductor patterns formed by via conductors, which allows for a small size and wide angular range without requiring multiple laminates, enabling cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible substrate with a partially thinned portion is bent to widen the communicable angular range, then the communicable angular range is improved, but the device size cannot be reduced due to patch conductor patterns formed on both sides of the bent part
Solution Approach 1:
The patent transitions from a 2D surface-based conductor pattern arrangement to a 3D vertical stacking arrangement. Multiple conductor patterns (ground patterns and radiating patterns) are positioned on different insulating layers stacked in the thickness direction, enabling spatial separation that achieves both miniaturization and wide angular coverage without requiring the substrate to be bent.
2Volume of moving object
If multiple laminates of different lamination directions are combined to achieve small size and wide communicable angular range, then the device size and angular range are improved, but the manufacturing process becomes complicated and costly
Solution Approach 1:
The patent merges multiple antenna functions and conductor patterns onto a single substrate structure with insulating layers stacked in the thickness direction. Instead of combining multiple separate laminates with different orientations, all ground patterns and radiating patterns are integrated into one unified multi-layer construction, simplifying the manufacturing process while achieving the desired compact size and wide angular range.
3Ease of manufacture
If via conductors larger in size in the first direction than in the second direction are used to form ground and radiating patterns, then the need for multiple laminates is eliminated, but the manufacturing precision requirements increase
Solution Approach 1:
The patent changes the dimensional parameters of the via conductors, making them larger in the first direction (x-direction) than in the second direction (y-direction). This anisotropic sizing allows the via conductors to effectively form both ground patterns and radiating patterns with appropriate electrical characteristics while maintaining manufacturability on a single substrate.
Data Source
AI summary
Disclosed herein is an antenna device that includes: a substrate having a plurality of insulating layers laminated in a z-direction; a first ground pattern formed on a first insulating layer; a first radiating conductor pattern formed on a second insulating layer; a second ground pattern constituted by a first via conductor provided so as to penetrate at least two insulating layers; and a second radiating conductor pattern constituted by a second via conductor provided so as to penetrate at least one insulating layer. The first radiating conductor pattern overlaps the first ground pattern in the z-direction. The second radiating conductor pattern overlaps the second ground pattern in a y-direction.