Antenna Device Via Tilting for Transmission Stability
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Solution Overview
Problem
Existing antenna devices experience fluctuations in transmission characteristics due to capacitive coupling variations, which affect the reliability and consistency of high-frequency signal transfer across multiple layers of dielectric substrates.
Innovation Solution
The antenna device employs a configuration with multiple dielectric plates, conductive vias, and conductor plates, where high-frequency signals are transferred through a combination of electromagnetic coupling and capacitive coupling, minimizing the aspect ratio of vias and using adhesive layers to stabilize the structure, thereby reducing fluctuations in transmission characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple vias are disposed side by side in the stacking direction to reduce aspect ratio, then long-term reliability with respect to temperature change is improved, but transmission characteristic fluctuates due to capacitive coupling variations
Solution Approach 1:
The patent changes the geometric parameters of the via structure by tilting the vias relative to the stacking direction. This tilt angle modification alters the capacitive coupling characteristics between adjacent vias, thereby stabilizing the transmission characteristic while maintaining the reduced aspect ratio benefit for reliability.
Solution Approach 2:
The patent introduces asymmetry in the via configuration by tilting the vias at specific angles rather than disposing them symmetrically side by side. This asymmetric tilt arrangement optimizes the electromagnetic field distribution and reduces unwanted capacitive coupling effects, stabilizing the transmission characteristic.
2Reliability
If via aspect ratio is reduced by disposing vias side by side, then reliability is improved, but unnecessary radiation and parallel plate mode influences occur
Solution Approach 1:
The patent modifies the via orientation parameter by tilting the vias relative to the stacking direction. This angular adjustment changes the electromagnetic field confinement characteristics, reducing parallel plate mode formation and minimizing unnecessary radiation while preserving the low aspect ratio benefit.
3Ease of manufacture
If conventional coaxial-stripline converter structure is used, then signal transfer is achieved, but transmission characteristic fluctuates affecting consistency
Solution Approach 1:
The patent applies parameter changes by tilting the vias at optimized angles within the dielectric substrate. This geometric modification stabilizes the capacitive coupling between vias, ensuring consistent transmission characteristics across temperature variations and manufacturing tolerances while maintaining ease of manufacture.
Solution Approach 2:
The patent applies local quality optimization by specifically tilting the vias in the signal transfer path while maintaining other structural elements conventional. This localized modification targets the capacitive coupling region to stabilize transmission characteristics without complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the transmission characteristic of the antenna device, improving long-term reliability and reducing the impact of temperature changes, while preventing unnecessary radiation and parallel plate mode influences, ensuring consistent performance across products.
Implementation Method 1
high-frequency signals are transferred through a combination of electromagnetic coupling and capacitive coupling
Implementation Method 2
capacitive coupling of the vias opposed to each other enable transfer from the coaxial connector to the signal line
Data Source
AI summary
An antenna device according to an aspect of the present invention includes dielectric plates, a first to fourth vias, lines, a conductor plate, opening sections, and an antenna element for transmission. The first to fourth vias respectively pierce through the dielectric plates corresponding to the vias and transmit high-frequency signals. A high-frequency signal flowing in the first via is transmitted to the element via a line and an opening section. The line is provided on an upper surface of a dielectric plate and is connected to an upper end portion of the first via. The opening section is provided right above a part of the line. A high-frequency signal flowing in the second, the third, and the fourth vias is transmitted from another line. The line is provided on an upper surface of another dielectric plate and is connected to an upper end of the second via.