Microstrip Antenna Void Structure for Flexible Frequency Tuning
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Solution Overview
Problem
Existing microstrip antennas lack flexibility in designing the frequency of radio-frequency signals they can transmit and receive.
Innovation Solution
Incorporating annular openings and voids in the antenna conductor and reference conductor layers, with optional use of high or low dielectric constant materials in non-forming regions, to adjust the dielectric constant and wavelength of radio-frequency signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional microstrip antenna structure is used, then the antenna can transmit and receive radio-frequency signals, but the flexibility in designing the frequency is limited
Solution Approach 1:
The patent changes the dielectric constant parameter by introducing insulative substrate non-forming regions (voids or regions with different dielectric constants) beneath the antenna conductor layer and reference conductor layer. This allows adjustment of the effective dielectric constant experienced by the radio-frequency signal, thereby enabling flexible frequency design without fundamentally changing the antenna structure
Solution Approach 2:
The patent introduces insulative substrate non-forming regions that create a porous or heterogeneous structure beneath the conductor layers. These regions can be voids or filled with materials having different dielectric constants, effectively creating a composite dielectric structure that tunes the electromagnetic properties and enables frequency flexibility
2Length of moving object
If the antenna structure is made thinner, then the device profile is improved, but the structural integrity and performance may be compromised
Solution Approach 1:
The patent uses a composite structure combining the insulative substrate with insulative substrate non-forming regions (voids or regions filled with materials of different dielectric constants). This composite dielectric structure maintains structural integrity while reducing overall thickness, as the non-forming regions replace portions of the substrate material without compromising the mechanical support provided by the surrounding substrate and conductor layers
3Adaptability or versatility
If annular openings and voids are introduced in the antenna conductor and reference conductor layers, then frequency design flexibility is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent incorporates the insulative substrate non-forming regions during the substrate formation process itself, before the antenna conductor and reference conductor layers are deposited. By forming these regions preliminarily in the substrate, the subsequent conductor layer deposition and pattern formation can proceed using standard processes, avoiding the need for additional complex fabrication steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high flexibility in designing the frequency of radio-frequency signals, allows for easy bending, reduces thickness, and improves radiation efficiency of the antenna element.
Implementation Method 1
a low dielectric constant material having a lower dielectric constant than a dielectric constant of a material of the insulative substrate or a high dielectric constant material having a higher dielectric constant than the dielectric constant of the material of the insulative substrate is provided in the one or more first insulative substrate non-forming regions
Data Source
AI summary
An antenna element includes a first opening including an annular outer boundary in an antenna conductor layer. A first insulative substrate non-forming region is provided between an insulative substrate and the antenna conductor layer in an up-down direction. The insulative substrate does not exist in the first insulative substrate non-forming region. The outer boundary of the first opening overlaps one or more first insulative substrate non-forming regions and is not in contact with the insulative substrate. The first insulative substrate non-forming region is a first void, and a low dielectric constant material having a lower dielectric constant than that of a material of the insulative substrate or a high dielectric constant material having a higher dielectric constant than that of the material of the insulative substrate is provided in the first insulative substrate non-forming region.


