Antenna Wrapped Around Speaker Lid
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Solution Overview
Problem
Existing mobile device antennas often require larger structures and surface areas, which can hinder device miniaturization and impact performance, particularly in wireless communication and audio applications.
Innovation Solution
A method involving the integration of a first conductive trace portion plated on a device part and a second flexible printed circuit portion, where the flexible circuit wraps around and is soldered to the plated portion, reducing the overall size and enhancing antenna performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional antenna structures are used in mobile devices, then antenna functionality is achieved, but the device size and surface area increase
Solution Approach 1:
The antenna trace is wrapped around the speaker lid, nesting the antenna structure within the existing device geometry rather than requiring separate antenna space. This allows the antenna to be integrated into the device's existing form factor, reducing overall device volume while maintaining antenna functionality
Solution Approach 2:
The antenna transitions from a planar two-dimensional trace to a three-dimensional wrapped structure around the speaker lid. This dimensional change allows the antenna to achieve the required electrical length and performance characteristics within a smaller footprint, effectively utilizing vertical and curved spaces rather than only horizontal plane area
2Device complexity
If antenna traces are integrated onto device casing, then device complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The antenna is divided into two distinct portions: a first portion formed by plated conductive traces on the device casing, and a second portion formed by a separate flexible printed circuit. This segmentation allows each portion to be manufactured and optimized independently, with the flexible circuit portion providing tolerance compensation to reduce overall manufacturing precision requirements
Solution Approach 2:
Solder is used as an intermediary material to join the flexible printed circuit portion to the plated conductive trace portion. This intermediary connection method provides flexibility in alignment and tolerance accommodation, reducing the stringency of direct mechanical or adhesive bonding requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the thickness and surface area of the antenna structure, improving both antenna and audio performance by allowing for a more compact design and efficient signal transmission.
Implementation Method 1
The solder may be melted to attach the first portion of the antenna which is formed by plating conductive traces on the first device part, to the second portion of the antenna which is formed by attaching the flexible printed circuit to the second device part
Implementation Method 2
A laser beam may be applied to the plastic along a track corresponding to the antenna trace which may form a region activated for subsequent metallization
Data Source
AI summary
An antenna includes a first portion and a second portion soldered together. The first portion includes conductive traces applied to a first device part. The conductive traces may wrap from one side of the first device part to another side. A second device part is attached to the first device part to enclose a speaker. The second portion of the antenna comprises FPC attached to the second device part. A section of the FPC portion of the antenna extends beyond an edge of the second part and folds over onto solder applied to a section of first portion of the antenna on the first device part. The solder may be melted to attach the first portion of the antenna on the first device part to the second portion of the antenna on the second device part.