Anti-bending Frame for Probe Card Mechanical Strength
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor and wafer testing tools face challenges in mechanical strength and environmental data monitoring, leading to inefficiencies in the testing process and production efficiency.
Innovation Solution
A detection apparatus with an anti-bending device that includes a probe card circuit board, sensors, a processing circuit, and a transmission part, featuring an anti-bending frame with fixed edges to enhance mechanical strength and collect environmental data such as temperature and pressure during testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a stiffener is mounted on the probe card to improve mechanical strength, then the mechanical strength is improved, but the device complexity increases
Solution Approach 1:
The patent combines the anti-bending frame with multiple functional components (sensors, processing circuits, transmission parts) into a single integrated structure mounted on the probe card. This merging approach provides mechanical support while simultaneously enabling environmental monitoring, thereby improving strength without proportionally increasing complexity.
Solution Approach 2:
The anti-bending frame serves multiple functions: it provides mechanical support to prevent probe card deformation, houses sensors for environmental monitoring, contains processing circuits for data handling, and includes transmission parts for signal communication. This multi-functionality reduces the need for separate components, addressing the strength-complexity contradiction.
2Measurement precision
If sensors and processing circuits are added to the anti-bending frame for environmental data collection, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The anti-bending frame incorporates self-contained sensing and processing capabilities that autonomously monitor environmental conditions and handle data without requiring external complex systems. The integrated sensors, processing circuits, and transmission parts work together as a self-sufficient unit, improving measurement precision while minimizing additional complexity.
3Strength
If an anti-bending frame with fixed edges is used to strengthen the probe card, then strength is improved, but manufacturing precision requirements increase
Solution Approach 1:
The anti-bending frame is designed with fixed edges that can be separately manufactured and then mounted on the probe card. This segmentation allows for specialized manufacturing of the frame component with precise edge features, while the overall probe card assembly maintains manufacturing feasibility. The frame acts as a modular element that strengthens the probe card without requiring the entire assembly to meet extremely high manufacturing precision standards.
Data Source
AI summary
A detection apparatus and an anti-bending device thereof are provided. The detection apparatus includes a probe card circuit board, at least one probe, and the anti-bending device. The probe card circuit board has a first board surface and a second board surface on opposite sides thereof. The at least one probe is mounted on the first board surface. The anti-bending device includes an anti-bending frame, at least one sensor, a processing circuit, and a transmission part. The anti-bending frame is mounted on the second board surface of the probe card circuit board, and the at least one sensor is disposed on the anti-bending frame or the probe card circuit board. The processing circuit is disposed inside the anti-bending frame. The transmission part is mounted on the anti-bending frame, and is electrically coupled to the processing circuit.