Anti-Multipactor Coating With Roughened Silver for Low SEY

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Solution Overview

Problem

High power devices in vacuum environments face multipactor discharges due to secondary electron emission, limiting power transmission and requiring anti-multipactor coatings with low secondary electron emission yield (SEY) and resistance to air exposure, while existing methods are costly, inefficient, or result in increased insertion loss.

Innovation Solution

A low SEY anti-multipactor coating deposited onto a substrate using a process involving high conductive metal layers with controlled surface roughness achieved through chemical methods, including deposition, acid etching, activation, and electroless plating, maintaining low SEY and insertion loss even after air exposure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If silver coating is used for high electrical conductivity, then electrical conductivity is improved, but secondary electron emission yield increases above 2 after air exposure

Engineering Contradiction:
Improveelectrical conductivityVSAvoidsecondary electron emission yield
Core Design Contradiction:
Loss of energyVSObject-generated harmful factors

Solution Approach 1:

The patent applies composite materials by combining silver coating with a roughened surface structure. The silver layer provides high electrical conductivity while the roughened surface (with grooves, pits, or protrusions) reduces secondary electron emission yield to below 1.1, creating a composite surface that achieves both low energy loss and low harmful electron emission.

Inventive Principle:
Principle #40Composite materials

2Object-generated harmful factors

If surface roughness is increased to reduce secondary electron emission, then secondary electron emission yield is reduced, but insertion loss increases due to high surface electrical resistance

Engineering Contradiction:
Improvesecondary electron emission yieldVSAvoidinsertion loss
Core Design Contradiction:
Object-generated harmful factorsVSLoss of energy

Solution Approach 1:

The patent applies local quality by creating localized roughened regions (grooves, pits, or protrusions) on the silver surface rather than uniform roughening. This localized approach reduces secondary electron emission at specific high-risk areas while maintaining sufficient smooth areas to preserve low surface electrical resistance and minimize insertion loss.

Inventive Principle:
Principle #3Local quality

3Ease of operation

If air exposure is allowed for practical applications, then ease of operation is improved, but secondary electron emission yield increases from 0.5 to 2 making coatings unusable

Engineering Contradiction:
Improveair exposure toleranceVSAvoidsecondary electron emission yield
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The patent applies preliminary action by pre-roughening the silver surface before air exposure. The roughened surface structure is created in advance through chemical etching or mechanical means, which establishes a permanent geometric configuration that maintains low secondary electron emission yield even after prolonged air exposure, allowing practical operational use.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The coating effectively reduces secondary electron emission and insertion loss, allowing high power devices to operate at high frequencies without multipactor discharges, with SEY between 0.4 and 0.9 and insertion loss of 0.1-0.14 dB, and maintains performance after long air exposure.

Implementation Method 1

A first conductive layer is chemically deposited onto the substrate

Methodology Applied
Scientific EffectChemical deposition: Chemical Vapour Deposition

Implementation Method 2

The coating is then etched with an acid solution to increase the surface roughness

Methodology Applied
Scientific EffectAcid etching: Erosion

Implementation Method 3

A second conductive layer is then electroless plated onto the etched surface

Methodology Applied
Scientific EffectElectroless plating: Electrodeposition

Data Source

PatentEP3196917B1Anti-multipactor device
Publication Date: 2024.11.06 TESAT SPACECOM GMBH & CO KG
  • EP3196917B1 patent drawingFigure 1a~1b
  • EP3196917B1 patent drawingFigure 2
  • EP3196917B1 patent drawingFigure 3a~3b

AI summary

The invention relates to a coating deposited on a substrate that can be exposed to the air and to the method for the production thereof by means of simple chemical methods. The invention also relates to the use thereof for the production of high-power devices operating at high frequencies.