Antiadhesion Layer for Temporary Substrate Connection
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Solution Overview
Problem
The semiconductor industry faces challenges in handling and stripping thin product substrates due to high material and energy consumption, time-consuming chemical processes, and potential damage during the separation of interconnect layers, which can lead to destruction of the substrates.
Innovation Solution
Applying an antiadhesion layer on the product substrate, particularly around the peripheral edges, to create a receiving space for structures like chips, allowing for minimal energy detachment and protection from external effects, with controlled adhesion forces and flexible carrier holders for gentle stripping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If double-sided adhesive films or liquids are used for temporary connection, then the product substrate can be connected to the carrier substrate, but high material consumption of expensive materials occurs
Solution Approach 1:
The patent applies the antiadhesion layer locally at the peripheral edge region rather than across the entire substrate surface. This localized application reduces material consumption of expensive antiadhesion materials while maintaining sufficient connection reliability at the critical peripheral regions where substrates are handled and stripped.
Solution Approach 2:
The connection interface is segmented into different functional zones: a peripheral edge region with antiadhesion properties for easy stripping, and a central region without antiadhesion layer for stable connection during processing. This segmentation allows optimized material usage in different functional areas.
2Strength
If high temperatures are used in temporary connection, then connection strength is improved, but energy consumption increases
Solution Approach 1:
The patent changes the adhesion parameters by introducing an antiadhesion layer with specific surface energy characteristics. This allows the connection to be formed at lower temperatures while maintaining sufficient strength during processing, and enables easy detachment without requiring high energy input for breaking strong bonds.
Solution Approach 2:
The system transitions from a static strong-bond connection to a dynamic connection that can be easily activated and deactivated. The antiadhesion layer provides a connection that is stable during processing but can be easily released with minimal energy input, creating a dynamically controllable adhesion state.
3Reliability
If chemical dissolution is used to separate the interconnect layer, then stripping is achieved, but the process becomes time-consuming and complex
Solution Approach 1:
The patent replaces chemical dissolution methods with a mechanically simple stripping process. The antiadhesion layer at the peripheral edge region allows the substrate to be easily peeled or separated from the carrier substrate through mechanical means alone, eliminating the need for time-consuming chemical processing steps.
Solution Approach 2:
The antiadhesion layer is extracted or removed from the central connection area and applied only at the peripheral edge region. This extraction of the antiadhesion function to specific locations enables simple mechanical stripping without requiring chemical dissolution of interconnect layers across the entire substrate.
4Reliability
If chemical dissolution is used for interconnect layer separation, then stripping is achieved, but cleaning of the product substrate becomes necessary
Solution Approach 1:
The patent converts the potential harm of chemical residue from incomplete dissolution into a benefit by using a mechanical stripping method. The antiadhesion layer enables clean mechanical separation that leaves no chemical residues, eliminating the need for additional cleaning steps while maintaining effective stripping.
Solution Approach 2:
The antiadhesion layer acts as a disposable sacrificial element that enables clean separation. By providing a controlled interface that separates easily, it prevents contamination of the substrate that would otherwise require cleaning, effectively making the antiadhesion layer a single-use component that protects the substrate's cleanliness.
5Ease of operation
If thin substrates are handled without sufficient support, then handling is simplified, but substrate damage occurs due to lack of stability
Solution Approach 1:
The substrate is preliminarily supported and stabilized by connection to the rigid carrier substrate through the antiadhesion layer interface. This preliminary support provides the necessary stability during handling and processing, preventing substrate damage while maintaining ease of operation through the simple connection mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces material and energy usage, minimizes substrate damage, and streamlines the stripping process by applying controlled forces, ensuring efficient and non-destructive temporary connection and detachment of product substrates from carrier substrates.
Implementation Method 1
The antiadhesion layer is dimensioned and made such that upon making contact with the interconnect layer on the carrier substrate an adhesion force which is sufficient for processing and transport of the product substrate takes effect.
Data Source
AI summary
A method for temporary connection of a product substrate to a carrier substrate comprised of the steps of:applying an interconnect layer to a product substrate receiving side of the carrier substrate in an interconnect surface section of the product substrate receiving side,applying an antiadhesion layer with low adhesion force to one interconnect side of the product substrate in an antiadhesion surface section of the interconnect side, the antiadhesion surface section corresponding to the interconnect surface section, in terms of area, wherein a receiving space is formed which is bordered by the interconnect layer and the carrier substrate as well as the product substrate and the antiadhesion layer accommodating structures which are provided on the interconnect side of the product substrate and which project from the interconnect side,aligning the product substrate relative to the carrier substrate and bonding of the interconnect layer to the antiadhesion layer on one contact surface.