Antifogging Device With Inorganic Joining Part For Endoscope Sealing
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Solution Overview
Problem
Existing antifogging devices for endoscopes face challenges in effectively preventing fogging on optical members due to temperature and humidity differences, leading to reduced imaging field of view and potential sealing issues with the sealing member.
Innovation Solution
An antifogging device comprising a heater and temperature sensor mounted on a flexible substrate with a sealing member made of resin material, where a joining part made of inorganic material extends along the periphery to enhance sealing strength, and a method of manufacturing involving a circuit board with distinct areas for the heater, sensor, and sealing member, ensuring proper sealing and size reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing member made of resin material is applied to seal the heater and temperature sensor, then the sealing effect is improved, but the bonding strength between the sealing member and circuit board deteriorates
Solution Approach 1:
The patent applies different materials to different areas of the circuit board: an inorganic material (such as glass or ceramic) is used specifically at the periphery where the sealing member bonds to the board, while the central area maintains its original structure. This local differentiation allows the sealing member to achieve both good sealing effect and strong bonding strength at the bonding interface.
Solution Approach 2:
The circuit board becomes a composite structure combining the original flexible substrate with an inorganic material layer at the periphery. This composite construction integrates the advantages of both materials: the flexibility and heat resistance of the original substrate with the bonding capability and structural stability of the inorganic material, thereby improving both sealing and bonding strength.
2Volume of moving object
If the circuit board is cut along the boundary between the first area and third area, then the size of the antifogging device is reduced, but the structural integrity during manufacturing deteriorates
Solution Approach 1:
The inorganic material layer is formed on the circuit board before the cutting process. This preliminary formation of the inorganic layer provides structural reinforcement to the board, allowing it to maintain integrity during subsequent cutting operations. The inorganic material acts as a protective layer that prevents the flexible substrate from deforming or breaking during manufacturing.
Solution Approach 2:
The inorganic material layer serves as a cushioning or protective layer that absorbs mechanical stress during the cutting process. This beforehand protection prevents structural failure of the flexible substrate, enabling the board to be cut into smaller components without compromising structural integrity during manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents fogging on the optical member by maintaining the objective lens at a controlled temperature, improving durability and reducing the size of the antifogging device while maintaining reliable sealing.
Implementation Method 1
a heater configured to apply heat to an optical member
Implementation Method 2
a temperature sensor configured to detect a temperature
Data Source
AI summary
An antifogging device includes: a heater configured to apply heat to an optical member; a temperature sensor configured to detect a temperature; a circuit board with a surface mounted the heater and the temperature sensor; a sealing member that is made of a resin material and that is applied to the surface to seal the heater and the temperature sensor; and a joining part that is provided on at least part of the surface and that is made of an inorganic material, the joining part being configured to: extend along a periphery of the surface in a state of being exposed to a side surface of the circuit board; and contact the sealing member.