Antistatic Plastic from Recycled PV Modules

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Solution Overview

Problem

Conventional methods for recycling silicon wafer-based photovoltaic modules are energy-intensive, produce hazardous waste, and result in recycled products of lower economic value, with existing methods failing to effectively utilize the encapsulant and backsheet materials.

Innovation Solution

A method of forming antistatic plastic by compounding crystalline silicon particles, encapsulant, and backsheet materials, with specific weight ratios and additives, to create a high-value recycled product that maintains mechanical strength and appropriate surface resistivity, thereby enhancing the recycling process and product value.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If physical methods are used to break or crush the module, then glass and silicon waste can be recycled, but the encapsulant and backsheet plastic parts are disposed of in landfill

Engineering Contradiction:
Improverecycling rate of photovoltaic module materialsVSAvoidlandfill waste from encapsulant and backsheet
Core Design Contradiction:
Loss of substanceVSObject-generated harmful factors

Solution Approach 1:

The patent combines encapsulant and backsheet materials with crystalline silicon particles through compounding to form an integrated antistatic plastic product, preventing separation and landfill disposal of these materials

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The invention creates a composite material consisting of crystalline silicon particles dispersed in a matrix of encapsulant and backsheet materials, transforming waste plastic components into a functional composite with antistatic properties

Inventive Principle:
Principle #40Composite materials

2Loss of substance

If high-temperature methods are used to burn the encapsulant and backsheet plastic, then inorganic materials can be recycled, but a lot of energy is consumed and exhaust gas is produced

Engineering Contradiction:
Improverecycling of inorganic materialsVSAvoidenergy consumption of high-temperature processing
Core Design Contradiction:
Loss of substanceVSUse of energy by moving object

Solution Approach 1:

The patent replaces thermal processing with mechanical compounding and mixing processes, achieving material integration without high-temperature combustion or energy-intensive thermal treatment

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The encapsulant and backsheet materials serve dual purposes: as waste components to be disposed of and as binding matrix materials in the composite, eliminating the need for separate processing steps

Inventive Principle:
Principle #25Self-service

3Loss of substance

If high-temperature methods are used to burn the encapsulant and backsheet plastic, then inorganic materials can be recycled, but exhaust gas is produced which may deplete the ozone layer

Engineering Contradiction:
Improverecycling of inorganic materialsVSAvoidexhaust gas from combustion
Core Design Contradiction:
Loss of substanceVSObject-generated harmful factors

Solution Approach 1:

The patent converts potentially harmful plastic waste materials into beneficial functional components of the composite, where encapsulant and backsheet materials provide structural matrix and antistatic properties without combustion

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The invention replaces chemical combustion processes with mechanical compounding, eliminating exhaust gas production while achieving complete material utilization

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Loss of substance

If solvent methods are used to dissolve the encapsulant, then cracked glass and silicon waste can be recycled, but waste solvent is produced

Engineering Contradiction:
Improverecycling of glass and silicon wasteVSAvoidwaste solvent from dissolution process
Core Design Contradiction:
Loss of substanceVSObject-generated harmful factors

Solution Approach 1:

The patent replaces chemical dissolution with mechanical mixing and compounding processes, achieving material integration without solvent use and eliminating waste solvent generation

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The encapsulant material serves as both the substance to be recycled and the binding agent in the composite, eliminating the need for separate solvents

Inventive Principle:
Principle #25Self-service

5Loss of substance

If conventional recycling methods are used, then some materials can be recovered, but the economic value of the recycled product is lower than the recycling cost

Engineering Contradiction:
Improvematerial recovery rateVSAvoideconomic value of recycled product
Core Design Contradiction:
Loss of substanceVSProductivity

Solution Approach 1:

The invention creates a high-value composite material with specific functional properties (antistatic characteristics, mechanical strength) that commands higher market value, making the recycling process economically viable

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent optimizes the composition ratios (10 parts crystalline silicon, 1-30 parts encapsulant, 0.5-25 parts backsheet material) to achieve optimal balance between mechanical properties and antistatic performance, enhancing product value

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20240209196A1Antistatic plastic and method of forming the same
Publication Date: 2024.06.27 IND TECH RES INST

AI summary

A method of forming an antistatic plastic includes providing a mixture containing 10 parts by weight of crystalline silicon particles, 1 to 30 parts by weight of an encapsulant, and 0.5 to 25 parts by weight of a backsheet material. The mixture is compounded to form an antistatic plastic, wherein the encapsulant is different from the backsheet material.