AOI Lens Setup for IC Package Height and Lid Alignment Inspection

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Solution Overview

Problem

The semiconductor industry faces challenges in efficiently inspecting various aspects and features of articles during package manufacture or assembly, such as conductor integrity, substrate dimensions, and component placement, due to the need for smaller and more creative packaging techniques, which existing AOI systems struggle to address effectively.

Innovation Solution

An AOI system utilizing a CCD camera with a lens having an f-stop number greater than 8 and magnification greater than 0.4, along with a specific aperture, is used to inspect integrated circuit packages, providing better image focus, a greater working distance, and improved depth of field, reducing false lid offset alarms and increasing throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If existing AOI systems are used to inspect integrated circuit packages with varying heights, then inspection coverage is limited, but the system requires frequent lens adjustments and vertical position changes, reducing throughput

Engineering Contradiction:

Improveinspection throughputVSAvoidlens adjustment complexity

Core Design Contradiction:

ProductivityVSEase of operation

Solution Approach 1:

The patent changes the optical parameters by using a lens with a specific f-stop number (greater than 8) and magnification (greater than 0.4) to achieve a depth of field that encompasses the entire height range of different integrated circuit packages. This parameter change eliminates the need for frequent adjustments while maintaining inspection quality across varying package heights.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The AOI system is designed with a universal lens configuration that can inspect multiple package types with different heights using the same vertical position settings. The lens serves multiple functions by providing both the required magnification and an extended depth of field, making the system adaptable to various package configurations without requiring operational changes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Measurement precision

If a lens with higher magnification is used to inspect small features, then measurement precision improves, but the depth of field decreases, limiting the ability to inspect packages of varying heights

Engineering Contradiction:

Improvefeature inspection accuracyVSAvoiddepth of field

Core Design Contradiction:

Measurement precisionVSLength of stationary object

Solution Approach 1:

The patent optimizes the lens parameters by selecting a magnification greater than 0.4 paired with an f-stop number greater than 8. This specific parameter combination achieves a balance where sufficient magnification for feature inspection is maintained while the depth of field is extended to encompass the entire package height range, resolving the traditional trade-off between these two parameters.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If the AOI system inspects packages with different heights using fixed vertical positions, then throughput increases, but inspection precision may be compromised for certain package heights

Engineering Contradiction:

Improveinspection throughputVSAvoidalignment measurement accuracy

Core Design Contradiction:

ProductivityVSMeasurement precision

Solution Approach 1:

The patent changes the optical parameters to achieve a depth of field that covers the entire height range of different integrated circuit packages. This allows the system to maintain precise alignment measurements for all package heights while operating at fixed vertical positions, thereby preserving both throughput and measurement precision simultaneously.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system enhances manufacturing efficiency by improving focus and reducing false alarms, allowing for higher throughput and more efficient inspection of integrated circuit packages with varying heights without lens adjustments.

Implementation Method 1

Methodology Applied

Scientific EffectOptical focusing: Focusing

Implementation Method 2

An AOI system utilizing a CCD camera with a lens having an f-stop number greater than 8 and magnification greater than 0.4

Methodology Applied

Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS20250299314A1Automatic optical inspection system and method

Publication Date: 2025.09.25 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.