AP PCB Antenna Layout for Cable-Free Assembly and RF Isolation
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Solution Overview
Problem
The assembly of access point (AP) devices in wireless local area networks is inefficient and error-prone due to the manual plugging of radio frequency coaxial cables, which requires frequent flipping of the printed circuit board (PCB) and leads to complex antenna connections.
Innovation Solution
The integration of antennas directly onto the PCB, allowing for automated assembly and reducing the need for manual plugging, along with the strategic placement and shielding of devices to minimize radiation interference and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual plugging of radio frequency coaxial cable is used to connect antenna to PCB, then connection reliability is improved, but assembly efficiency deteriorates and assembly complexity increases
Solution Approach 1:
The patent merges the antenna and PCB into a single integrated structure where the antenna is directly mounted on the PCB substrate. This eliminates the need for separate coaxial cable connections while maintaining RF signal integrity through direct electrical contact between the antenna feed point and PCB trace, thereby improving assembly efficiency without compromising connection reliability.
2Reliability
If manual plugging of radio frequency coaxial cable is used, then connection reliability is improved, but assembly complexity increases due to frequent PCB flipping
Solution Approach 1:
By integrating the antenna directly onto the PCB, the patent eliminates the need for separate cable assembly and plugging operations. The antenna becomes a permanent part of the PCB structure, allowing single-sided assembly operations without frequent PCB flipping, thereby reducing assembly complexity while maintaining connection reliability through direct electrical connection.
3Productivity
If multiple devices are densely arranged on PCB, then device integration is improved, but heat dissipation deteriorates due to concentrated heat sources
Solution Approach 1:
The patent segments the PCB into multiple thermal zones with different device densities. High-power heat-generating devices are strategically positioned in areas with adequate thermal ventilation and heat dissipation pathways, while low-power devices are placed in more densely packed regions. This segmented arrangement maintains high device integration while preventing excessive local temperature rise through optimized thermal management.
4Area of stationary object
If device with large conductor structure is placed close to antenna, then PCB space utilization is improved, but signal quality deteriorates due to radiation interference
Solution Approach 1:
The patent applies local quality principles by creating an electromagnetic shield between the antenna and high-conductor devices using conductive shielding structures or ground planes. This localized shielding maintains close proximity of devices for better PCB space utilization while preventing harmful radiation interference with the antenna signal, thus preserving signal quality through targeted electromagnetic isolation.
Data Source
AI summary
An AP device includes a lower housing, a PCB assembly, and an upper cover. The PCB assembly is located in a cavity between the upper cover and the lower housing. The PCB assembly includes a PCB, an antenna, a first device, and a second device. The antenna is fastened to an upper surface of the PCB. The first device is located on the upper surface, and a height of the first device is less than a first height threshold or a conductor structure proportion is less than a proportion threshold. The second device is located on a lower surface of the PCB, and a height of the second device is greater than the first height threshold and a conductor structure proportion is greater than the proportion threshold.