Avalanche Photodiode Light Guide Structure for Higher Sensitivity

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Solution Overview

Problem

Existing photoelectric conversion elements, such as avalanche photodiodes, face challenges in efficiently guiding charges generated by photoelectric conversion to the avalanche multiplication region, which affects the light receiving sensitivity.

Innovation Solution

A photoelectric conversion element with a semiconductor layer structure that includes a light guide structure and an optical structure layer, where the light guide structure surrounds the avalanche multiplication region and is disposed over a depth of at least 0.8 μm from the second face, effectively guiding incident light to the avalanche multiplication region, enhancing light receiving sensitivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a conventional light collecting structure is used, then the structure is simple, but the charge guiding efficiency to the avalanche multiplication region is insufficient

Engineering Contradiction:
Improvecharge guiding efficiencyVSAvoidlight guide structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The light guide structure is divided into a first portion and a second portion with different configurations. The first portion has a first width and the second portion has a second width that is larger than the first width, creating a stepped structure that efficiently guides charges to the avalanche multiplication region while maintaining manageable complexity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The light guide structure extends in the depth direction with different portions at different depths. The second portion is disposed over a depth of at least 0.8 μm from the second face, utilizing the third dimension to improve charge guiding efficiency without proportionally increasing planar complexity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the light guide structure is extended deeper, then the light receiving sensitivity improves, but the manufacturing precision requirement increases

Engineering Contradiction:
Improvelight receiving sensitivityVSAvoiddepth positioning precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The light guide structure has different widths at different portions: the first portion has a first width and the second portion has a second width that is larger than the first width. This local variation in geometry allows the structure to extend to sufficient depth (at least 0.8 μm) while maintaining manufacturing feasibility through gradual transitions

Inventive Principle:
Principle #3Local quality

3Productivity

If the second portion width is increased, then the charge collection efficiency improves, but the device complexity increases

Engineering Contradiction:
Improvecharge collection efficiencyVSAvoidlight guide structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The light guide structure is segmented into a first portion and a second portion, where the second portion has a larger width than the first portion. This segmentation allows the structure to widen where needed for charge collection while maintaining a manageable overall complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The width of the light guide structure varies locally: the first portion has a first width and the second portion has a second width that is larger. This local quality variation optimizes charge collection efficiency at the second portion while keeping the first portion simpler

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution efficiently guides charges to the avalanche multiplication region, thereby improving the light receiving sensitivity of the photoelectric conversion element, ensuring better photon detection efficiency and reducing shading effects.

Implementation Method 1

a light guide structure arranged in the semiconductor layer and having a first portion disposed so as to surround a first region in a plan view and a second portion disposed so as to surround a second region inside the first region in the plan view

Methodology Applied
Scientific EffectRefraction: Refraction

Implementation Method 2

the second portion is disposed over a depth of at least 0.8 μm from the second face

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 3

a second semiconductor region of a second conductivity type arranged closer to the second face than the first semiconductor region and forming a p-n junction with the first semiconductor region to form an avalanche photodiode

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Implementation Method 4

an avalanche photodiode (hereinafter referred to as "APD") that multiplies charges generated by incidence of photons by avalanche breakdown

Methodology Applied
Scientific EffectAvalanche breakdown: Avalanche Breakdown

Data Source

PatentUS20240088186A1Photoelectric conversion element and photoelectric conversion device
Publication Date: 2024.03.14 CANON KK
  • US20240088186A1 patent drawing
  • US20240088186A1 patent drawing
  • US20240088186A1 patent drawing

AI summary

A photoelectric conversion element includes in a semiconductor layer a first semiconductor region arranged, a second semiconductor region arranged on a second face side closer than the first semiconductor region and forming a p-n junction with the first semiconductor region to form an avalanche photodiode, a light guide structure including a first portion surrounding a first region and a second portion surrounding a second region inside the first region in a plan view, and an optical structure layer disposed on the second face side. The second portion is disposed over a depth of at least 0.8 μm from the second face, the first and second semiconductor regions are arranged closer to the first face than the second portion, and the second portion overlaps at least a portion of an avalanche multiplication region between the first and second semiconductor region in the plan view.