Aperture-Coupled Microstrip-to-Waveguide Transition Design

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Solution Overview

Problem

Existing waveguide-to-coax adapters are bulky and not compatible with low-cost, conformal RF applications due to size, weight, and power (SWaP) constraints, making them unsuitable for direct integration with RF boards.

Innovation Solution

An aperture coupled microstrip-to-waveguide transition (ACMWT) is developed, comprising dielectric layers, a patch antenna element, and a coupling element, which supports TEM, TE, and TM signals, and is fabricated using lamination or 3-D additive printing processes to enable efficient signal transmission and reduce adapter size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If waveguide-to-coax adapters are used for signal transition, then signal transmission capability is improved, but device size and weight increase

Engineering Contradiction:
Improvesignal transmission capabilityVSAvoidadapter weight
Core Design Contradiction:
ReliabilityVSWeight of stationary object

Solution Approach 1:

The patent combines the waveguide-to-coax transition function with the RF board mounting function into a single integrated adapter structure. The coaxial adapter includes an inner conductor, outer conductor, and dielectric material that directly interface with the RF board, eliminating the need for separate waveguide-to-coax and coax-to-RF board adapters. This merging reduces overall device weight while maintaining signal transmission capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adapter structure serves multiple functions simultaneously: it provides waveguide-to-coax transition, mounts directly to the RF board, and provides electrical connection. The inner conductor extends through the dielectric material to contact the RF board, while the outer conductor provides shielding and mounting attachment, making the adapter universally applicable for both transition and mounting purposes.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If waveguide-to-coax adapters are used for signal transition, then signal transmission capability is improved, but device volume increases

Engineering Contradiction:
Improvesignal transmission capabilityVSAvoidadapter volume
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent merges the waveguide-to-coax transition structure with the RF board mounting structure into a single compact adapter. The inner conductor, outer conductor, and dielectric material are arranged in a compact configuration that directly mounts to the RF board, reducing the overall volume compared to separate transition adapters and mounting hardware.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adapter structure employs a nested arrangement where the inner conductor is positioned within the dielectric material, which is in turn positioned within the outer conductor. This nested configuration maximizes space utilization and minimizes the overall adapter volume while maintaining electrical performance.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Reliability

If complex adapter structures with flanges and connection hardware are used, then signal transmission reliability is improved, but manufacturing cost increases

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple functions (waveguide transition, coaxial connection, RF board mounting) into a single adapter structure, reducing the total number of parts that need to be manufactured and assembled. This integration simplifies the manufacturing process and reduces costs associated with multiple flanges, connection hardware, and assembly operations.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adapter structure performs multiple functions simultaneously - providing waveguide-to-coax transition, mechanical mounting to the RF board, and electrical connection. This multi-functionality eliminates the need for separate mounting brackets and connection hardware, reducing manufacturing complexity and cost.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ACMWT provides a compact and efficient solution for signal transmission, enhancing compatibility with RF boards and reducing SWaP costs, while maintaining effective signal support for TEM, TE, and TM modes.

Implementation Method 1

waveguides are used in many RF applications for low-loss signal propagation

Methodology Applied
Scientific EffectElectromagnetic signal propagation: Waveguide

Implementation Method 2

a coupling element (CE) formed within the dielectric structure between the PAE and inner conductor

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Data Source

PatentUS10938082B2Aperture-coupled microstrip-to-waveguide transitions
Publication Date: 2021.03.02 THE BOEING CO
  • US10938082B2 patent drawing
  • US10938082B2 patent drawing
  • US10938082B2 patent drawing

AI summary

An aperture coupled microstrip-to-waveguide transition (“ACMWT”) is disclosed that includes a plurality of dielectric layers forming a dielectric structure and an inner conductor formed within the dielectric structure. The plurality of dielectric layers includes a top dielectric layer that has a top surface. The (“ACMWT”) further includes a patch antenna element (“PAE”) formed on the top surface, a bottom conductor, an antenna slot within the PAE, a coupling element (“CE”) formed above the inner conductor and below the PAE, and a waveguide. The waveguide includes at least one waveguide wall and a waveguide backend, where the waveguide backend has a waveguide backend surface that's a portion of the top surface of the top dielectric layer and where the waveguide backend surface and the at least one waveguide wall form a waveguide cavity within the waveguide. The PAE is a conductor located within the waveguide cavity at the waveguide backend surface.