Aperture Plate Electroplating for High Density Aerosol
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Solution Overview
Problem
Existing methods for manufacturing aperture plates for aerosol devices face challenges in achieving high aperture density and consistent particle size, as wafer thickness is intertwined with resist island placement, leading to limitations in aperture density and requiring non-standard drive controllers for optimal operation.
Innovation Solution
A method involving electroplating around resist columns with controlled over-plating to achieve desired aperture sizes and wafer thickness, allowing for a single masking/plating cycle, which increases aperture density and maintains standard drive controller compatibility, while also forming passageways for effective liquid funnelling and droplet entrainment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If wafer thickness is reduced to increase aperture density, then aperture density is improved, but drive controller compatibility deteriorates
Solution Approach 1:
The invention changes the geometric parameters of the wafer structure by introducing a non-planar configuration with raised peripheral portions and depressed central portions, allowing the wafer to maintain standard thickness while achieving higher effective aperture density through structural optimization rather than simple thinning
Solution Approach 2:
The invention transitions from a two-dimensional planar aperture distribution to a three-dimensional non-planar structure with varying thickness zones, creating raised peripheral regions and depressed central regions to simultaneously achieve high aperture density and maintain mechanical integrity for standard drive compatibility
2Quantity of substance
If wafer thickness is reduced to increase aperture density, then aperture density is improved, but manufacturing complexity increases
Solution Approach 1:
The invention incorporates preliminary action by pre-forming the non-planar wafer structure with integrated funnelling features during the manufacturing process, so that liquid guidance functionality is built-in from the start rather than requiring additional post-processing steps
Solution Approach 2:
The invention merges multiple functions into a single integrated wafer structure: the non-planar geometry simultaneously serves as the aperture plate, the funnelling mechanism, and the structural support, eliminating the need for separate components and reducing overall manufacturing complexity
3Productivity
If aperture density is increased to improve aerosol delivery efficiency, then productivity is improved, but aperture size consistency deteriorates
Solution Approach 1:
The invention applies local quality by creating distinct regions within the wafer with different geometric characteristics - the raised peripheral portions and depressed central portions create localized zones that optimize both aperture density and individual aperture uniformity, ensuring consistent droplet formation across the entire surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a higher aperture density, maintaining standard drive controller compatibility, and achieving consistent aerosol output with smaller droplet sizes, enhancing the efficiency and cost-effectiveness of aerosol delivery systems.
Implementation Method 1
a wafer is built onto a mandrel by a process of electro-deposition where the dissolved metal cations in the plating bath (typically Palladium and Nickel) are reduced using electrical current from the liquid form to the solid form on the wafer
Data Source
AI summary
An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.