Apertured Metallic Lid for Thermal Decoupling in Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-Bandwidth Memory (HBM) chips in semiconductor electronic packages face thermal limitations due to proximity with Application-Specific Integrated Circuit (ASIC) chips, leading to potential overheating and malfunction, while maintaining structural integrity is crucial.
Innovation Solution
A metallic lid with an aperture is positioned over the ASIC chip, allowing close thermal contact for heat dissipation while thermally decoupling the HBM chip, using thermal interface materials to manage heat transfer and prevent warpage, ensuring the HBM chip operates within its thermal limits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If HBM chip is positioned immediately adjacent to ASIC chip on interposer, then read/write operations can be performed at high speeds, but HBM chip overheating occurs due to thermal proximity
Solution Approach 1:
The lid is segmented with an aperture that exposes the HBM chip, creating distinct thermal zones. The lid covers the ASIC chip while leaving the HBM chip exposed through the aperture, allowing spatial separation of thermal management functions while maintaining structural unity
Solution Approach 2:
The lid acts as a thermal intermediary that selectively manages heat transfer. It provides thermal coupling for the ASIC chip while creating thermal decoupling for the HBM chip through the aperture, mediating the thermal interaction between components and the environment
2Temperature
If metallic lid covers ASIC chip for heat dissipation, then thermal contact is improved, but structural integrity may be compromised
Solution Approach 1:
The lid is segmented with a strategically positioned aperture that maintains structural integrity while enabling thermal management. The aperture is designed to expose the HBM chip while preserving sufficient lid material to maintain package strength and rigidity
Solution Approach 2:
The lid exhibits local quality variations through the aperture design. Different regions of the lid serve different functions: the covered region provides thermal management for ASIC, while the apertured region maintains structural support and exposes HBM chip, creating localized functional zones within a single component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents heat transfer from the ASIC chip to the HBM chip, maintaining the HBM's operational temperature within safe limits and enhancing the structural integrity of the package by acting as a stiffener, thereby increasing the reliability and performance of the semiconductor electronic package.
Implementation Method 1
A lid of the semiconductor electronic package is mounted over the ASIC chip so that a surface of the lid is in close thermal contact with a surface of the ASIC chip
Data Source
AI summary
Techniques are described to limit heat transfer from a first electronic component to a second electronic such as by having an aperture in a lid over the second electronic component to form a gap in the conductance of heat from the first electronic component to the second electronic component. A semiconductor electronic package includes a substrate, a first electronic component that is of a first type and that is mounted along a surface of the substrate, a second electronic component that is of a second type different than the first type and that is mounted along the surface of the substrate, and a metallic component that is positioned over the first electronic component and that has an aperture through which the second electronic component is exposed.