APK Fiber-Optic Microcable Structure to Prevent Kinking

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Solution Overview

Problem

Existing fiber-optic microcables are stiff, prone to kinking or hockling when twisted or bent, and lack flexibility, strength, and hydrophobic properties, making them unsuitable for flexible undersea applications.

Innovation Solution

A microcable design featuring a core, cladding, buffer, and jacket, with a yarn layer of Vectran® or similar materials, and an outer jacket of Aliphatic Polyketone (APK), which provides flexibility, high strength, and hydrophobicity, preventing kinking and hockling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a traditional e-glass outer jacket is used, then the microcable achieves high strength, but it becomes extremely stiff with a minimum bend radius of approximately 1.5 inches

Engineering Contradiction:
Improvetensile strengthVSAvoidflexibility
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The patent uses a composite construction with an e-glass reinforcement layer embedded in a polymeric outer jacket. This composite structure combines the high tensile strength of e-glass fibers with the flexibility of the polymer matrix, resolving the contradiction between strength and flexibility. The e-glass provides structural reinforcement while the polymer allows for easier bending and manipulation.

Inventive Principle:
Principle #40Composite materials

2Strength

If the microcable is made with traditional materials, then it achieves adequate strength, but it is prone to kinking or hockling when twisted or bent

Engineering Contradiction:
Improvetensile strengthVSAvoidresistance to kinking and hockling
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent employs a polymeric outer jacket that acts as a flexible shell surrounding the e-glass reinforcement. This flexible protective layer prevents the microcable from kinking or hockling during twisting and bending operations, while still allowing the e-glass to provide the necessary tensile strength. The polymer jacket conforms to bends without creating sharp kinks that would damage the internal structure.

Inventive Principle:
Principle #30Flexible shells and thin films

3Ease of operation

If the microcable diameter is reduced for small-diameter applications, then it achieves better flexibility, but it may compromise structural integrity

Engineering Contradiction:
ImproveflexibilityVSAvoidstructural integrity
Core Design Contradiction:
Ease of operationVSStrength

Solution Approach 1:

The patent uses a composite structure with e-glass reinforcement embedded in a polymeric matrix, which allows the microcable to maintain high structural integrity even at small diameters. The e-glass fibers provide strength-to-weight ratio advantages, enabling the cable to be both thin and strong. This composite approach allows the microcable to achieve diameters suitable for small-diameter applications while preserving structural integrity through the reinforcement layer.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS20260029572A1High-strength, small diameter fiber-optic microcable
Publication Date: 2026.01.29 SANMINA CORP
  • US20260029572A1 patent drawing
  • US20260029572A1 patent drawing
  • US20260029572A1 patent drawing

AI summary

A small diameter microcable is described that is flexible, elastic, high-strength, low-loss, hydrophobic and that does not kink or hockle when twisted or bent. In one example, the optical fiber microcable is a singlemode microcable with a diameter of 750 μm that includes: a core; a cladding; a buffer; a yarn around the buffer; and a jacket formed of Aliphatic Polyketone (APK) around the yarn. The yarn may be formed, e.g., of a liquid crystal polymer (LCP) or may be formed of other suitable materials. In another example, the optical fiber microcable is a singlemode microcable having a diameter of 360 μm that includes: a core; a cladding; a buffer around the cladding; and a jacket formed of APK around the buffer. Methods are also described for fabricating the microcables.