Apparel Electronic Subassembly Strain Relief Mechanism
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Solution Overview
Problem
Apparel manufacturers face challenges in integrating electronic devices within clothing while maintaining reliable electrical connections, as existing methods struggle to secure these connections during stretching or pulling forces applied to the fabric.
Innovation Solution
An electronic subassembly comprising a base panel with a fabric layer and an adhesive top panel forms a compartment for electronic components, with a strain relief mechanism to maintain electrical connections by absorbing stretching forces, using heat-treated adhesives and flexible materials to secure the assembly to the apparel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic devices are integrated within apparel, then functionality and user interaction are improved, but reliability of electrical connections deteriorates due to stretching and pulling forces
Solution Approach 1:
The patent implements a dynamic strain relief mechanism that allows the electrical connections to move and flex with the apparel during stretching and pulling. The mechanism includes movable components and flexible pathways that adapt to the dynamic forces applied to the garment, preventing disconnection while maintaining electrical contact throughout the range of motion.
Solution Approach 2:
The patent changes the physical parameters of the electrical connections by using flexible conductors with appropriate elongation properties and designing connection points that can withstand tensile forces. The strain relief mechanism modifies the transmission of forces by distributing and attenuating the stress through carefully designed geometric configurations and material selections.
2Adaptability or versatility
If electronic devices are secured within apparel, then integration is improved, but ease of manufacture deteriorates due to complex assembly requirements
Solution Approach 1:
The patent divides the electronic integration system into separate functional modules: electronic device components, strain relief mechanism, and apparel integration layer. This segmentation allows each component to be manufactured and tested independently, then assembled together, reducing overall assembly complexity while maintaining effective integration.
Solution Approach 2:
The patent introduces an intermediary strain relief mechanism that bridges the electronic device and the apparel fabric. This intermediary component simplifies the connection by providing a standardized interface that handles the complexity of force distribution and movement accommodation, making the overall assembly process more straightforward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively secures electronic components within apparel, maintaining reliable electrical connections despite fabric stretching, preventing disengagement and ensuring consistent functionality during use.
Implementation Method 1
a top panel comprising an adhesive layer secured to the base panel so as to form a compartment between the base panel and the top panel
Implementation Method 2
a strain relief mechanism that maintains a first electrical connection of the first electronic component with a second electrical connection of the second electronic component to reduce strain imparted to the first and second electrical connections when the surface of the apparel product to which the subassembly is secured is subjected to stretching or pulling forces
Data Source
AI summary
An electronic subassembly includes a base panel including a layer of fabric material, a top panel secured to the base panel so as to form a compartment between the base panel and the top panel, where the top panel includes an exterior surface that is configured to couple the subassembly with an apparel product, and a plurality of electronic components, where a first electronic component is disposed within the compartment and a second electronic component extends from the compartment to a location external to the compartment. A strain relief mechanism can also be provided that maintains a first electrical connection of the first electronic component with a second electrical connection of the second electronic component to reduce strain imparted to the first and second electrical connections when the surface of the apparel product to which the subassembly is secured is subjected to stretching or pulling forces.


