Integrated Appliance Backplate with Uneven Surface for Circuit Board Mounting
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Solution Overview
Problem
The manufacturing cost of integrated electric appliances is increased due to the need for a back cover, which requires a mold, exposing electronic components to damage and increasing the risk of electric shock if not covered.
Innovation Solution
An integrated appliance design that eliminates the back cover by using an uneven surface structure on the backplate to secure the circuit board directly, with features like riveting studs, screws, and reflective sheets to protect electronic components without the need for a separate back cover.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a back cover is used to protect electronic components, then reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the backplate and back cover into a single integrated structure. The backplate is designed with an uneven surface that directly receives and protects the electronic components, eliminating the need for a separate back cover. This integration reduces manufacturing cost by removing mold and material costs for the back cover while maintaining protection of the electronic components through the structured uneven surface design.
2Object-affected harmful factors
If a back cover is used to prevent electric shock, then safety is improved, but device complexity increases
Solution Approach 1:
The backplate is designed to perform both structural support and safety protection functions simultaneously. The uneven surface structure with receiving spaces provides both mechanical support for the circuit board and protective coverage for electronic components, eliminating the need for a separate back cover and reducing overall device complexity while maintaining safety.
Solution Approach 2:
The backplate is designed as a multi-functional component that provides structural support, component mounting, and safety protection all in one piece. The uneven surface creates receiving spaces that protect electronic components from electric shock while the backplate itself serves as the structural framework, reducing the need for additional protective components.
Data Source
AI summary
An integrated appliance is disclosed in the present disclosure. The integrated appliance comprises a backplate and a circuit board. The circuit board comprises a baseplate and an electronic component disposed on the baseplate. The baseplate is fixed to an inner wall of the backplate, and the electronic component is located between the baseplate and the backplate. With the aforesaid arrangement, an uneven surface structure of the backplate itself is utilized in the integrated appliance of the present disclosure to dispose the circuit board on the inner wall of the backplate in such a way that the electronic component on the circuit board is disposed facing towards an inner wall surface of the backplate. As this eliminates the use of the back cover, the structure is simplified and both the mold cost and the material cost associated with the back cover are saved, thus resulting in a reduced manufacturing cost.