Selective Solidification Application Device for Substrate Plate Transfer
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Solution Overview
Problem
Existing methods for producing three-dimensional components by selective solidification face challenges in achieving high capacity utilization and efficient substrate plate handling, leading to downtime and increased parts costs.
Innovation Solution
The method involves using an application device to transfer the uppermost substrate plate with finished components into an adjacent collecting chamber or magazine, allowing for continuous production without downtime. The application device also introduces non-solidified build material and is equipped with a guide element for secure substrate plate transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If a separate powder suction-extraction device with suction-extraction hood is used to extract non-solidified build material, then the build material extraction is effective, but the device complexity and parts costs increase
Solution Approach 1:
The application device is designed to perform multiple functions: applying build material, transferring substrate plates, and introducing non-solidified build material into the building cylinder. By merging these functions into a single device, the patent eliminates the need for a separate powder suction-extraction device with suction-extraction hood, thereby reducing device complexity and parts costs while maintaining effective build material extraction
Solution Approach 2:
The application device is configured as a multi-functional device that can apply build material to substrate plates, transfer substrate plates between the building cylinder and collecting chamber, and introduce non-solidified build material into the building cylinder. This universal device replaces multiple separate components, simplifying the overall device structure and reducing parts costs
2Reliability
If multiple substrate plates are stacked in the building cylinder with releasable holding devices, then the substrate plates are securely held against rotation and displacement, but the device complexity increases
Solution Approach 1:
The holding device is segmented into multiple independent holding elements distributed across the substrate plate stack. Each holding element can independently engage with corresponding features on adjacent substrate plates, providing localized stabilization without requiring a complex centralized holding mechanism. This segmentation allows reliable substrate plate positioning while maintaining device simplicity
Solution Approach 2:
The releasable holding device acts as an intermediary mechanism between the stacked substrate plates, providing temporary engagement to prevent rotation and displacement during the building process. The holding device can be selectively released when the application device needs to access and transfer substrate plates, enabling both stable stacking and easy manipulation without requiring complex mechanical structures
3Device complexity
If the application device transfers substrate plates manually or with separate handling mechanisms, then the transfer process is simple, but the productivity and capacity utilization decrease due to downtime
Solution Approach 1:
The application device combines the build material application function with the substrate plate transfer function in a single integrated mechanism. After applying build material to a substrate plate, the same application device automatically transfers the completed substrate plate to the collecting chamber and positions the next substrate plate in the building cylinder, eliminating idle time and maximizing productivity without requiring complex separate handling mechanisms
Solution Approach 2:
The application device operates continuously by performing build material application and substrate plate transfer in an uninterrupted sequence. While one substrate plate is being processed, the device automatically prepares and positions the next substrate plate, ensuring that the building cylinder is continuously occupied and productivity is maximized without downtime between operations
4Productivity
If substrate plates are transferred without guide elements, then the transfer process is faster and simpler, but the manufacturing precision and component protection are compromised
Solution Approach 1:
Guide elements are provided on the application device that act as intermediaries during substrate plate transfer. These guide elements engage with corresponding features on the substrate plates to ensure accurate alignment and positioning during transfer, preventing displacement and rotation while maintaining transfer speed. The guide elements provide the necessary precision without requiring complex positioning mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-capacity utilization and reduces parts costs by allowing multiple substrate plates to be used sequentially, achieving short cycle times and minimizing downtime. The secure transfer of substrate plates with guide elements ensures process reliability and protects components from damage.
Implementation Method 1
applies build material for selective solidification by means of a beam to the substrate plate in the building cylinder
Data Source
AI summary
The disclosure relates to methods and devices for producing three-dimensional components by selective solidification from build material applied in layered fashion by providing a building cylinder in which substrate plates are stacked one above the other, applying the build material to the uppermost substrate plate with an application device, generating at least one beam and directing the beam onto the applied layer of the build material, moving the application device along a working plane at least along the building cylinder and at least one collecting chamber for non-solidified build material, and moving the substrate plate out in relation to the building cylinder such that a bottom of the substrate plate lies in the working plane, wherein the substrate plate which has been moved out of the building cylinder is transferred by the application device from the building cylinder into the adjacent collecting chamber.