Application Needle Mechanism for Precision Substrate Contact
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Solution Overview
Problem
Conventional application mechanisms risk damaging the application needle tip and causing dents in substrates due to excessive pressure, especially when applying minute patterns or varying heights, and existing contact-pressure reducing mechanisms are insufficient at higher speeds.
Innovation Solution
An application mechanism with a slide mechanism and a position holding mechanism using a magnetic member and electromagnet, which maintains the application needle's position until contact with the substrate, allowing the needle to move based on self-weight and reducing contact load variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the application needle tip is formed thin to apply minute patterns, then the manufacturing precision is improved, but the contact pressure increases causing damage to the needle tip or substrate
Solution Approach 1:
The spring member functions as a counterweight mechanism that generates an upward elastic force to offset the downward gravitational force acting on the application needle. This balance prevents excessive contact pressure between the thin needle tip and the substrate, resolving the contradiction between achieving fine pattern precision and avoiding damage to the needle tip or substrate.
Solution Approach 2:
The spring member provides beforehand cushioning by being pre-compressed to store elastic energy that cushions the contact between the application needle and substrate. This prior cushioning prevents sudden impact forces and excessive pressure during the application process, protecting both the thin needle tip and the substrate while maintaining precision.
2Object-affected harmful factors
If a contact-pressure reducing mechanism is added, then the harmful contact pressure is reduced, but the device complexity increases
Solution Approach 1:
The spring member provides self-service by automatically adjusting the application needle's position through its elastic properties. The spring continuously exerts an upward force that self-regulates the contact pressure between the needle and substrate without requiring external control mechanisms, thereby reducing contact pressure while avoiding increased device complexity.
Solution Approach 2:
The spring member changes the force parameter acting on the application needle by introducing an elastic restoring force. This parameter change transforms the rigid gravitational force into a flexible, adjustable force that automatically adapts to maintain optimal contact pressure, reducing harmful effects without complicating the device structure.
3Productivity
If the application needle moves rapidly to increase productivity, then the productivity is improved, but the contact pressure reducing effect diminishes causing damage
Solution Approach 1:
The spring member provides beforehand cushioning that remains effective even at higher speeds. By pre-compressing the spring to store elastic energy before contact, the mechanism ensures that the cushioning effect is already in place when the application needle contacts the substrate, maintaining protection against damage regardless of the speed at which the needle approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses damage to the application needle tip and prevents dents in substrates by controlling the contact load, even with needles having tip diameters of 10 μm or less, ensuring precise and damage-free material application.
Implementation Method 1
an elastic member that applies force to the application needle so as to be moved toward the substrate
Implementation Method 2
a position holding mechanism that holds a relative position of the application needle fixing member with respect to the slide mechanism... constituted of a magnetic member and an electromagnet
Data Source
AI summary
An application mechanism according to one embodiment of the present invention serves as an application mechanism that applies an application material onto a substrate using an application needle. The application mechanism according to one embodiment of the present invention includes: a holder base; a slide mechanism attached to an inside of the holder base; an application needle fixing member, to which the application needle is attached, the application needle fixing member being supported by the slide mechanism so as to be slidable in an extending direction of the application needle; and a position holding mechanism that holds a relative position of the application needle fixing member with respect to the slide mechanism.


